PESD5V0S1BLD: Low capacitance bidirectional ESD protection diode

Low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode designed to protect one signal line from the damage caused by ESD and other transients.

The device is housed in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

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Data Sheets (1)
Name/DescriptionModified Date
Low capacitance bidirectional ESD protection diode (REV 1.0) PDF (303.0 kB) PESD5V0S1BLD15 Oct 2010
Brochures (2)
Name/DescriptionModified Date
Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 7501766403 Jul 2015
The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D21 Oct 2010
Package Information (1)
Name/DescriptionModified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D08 Feb 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
PESD5V0S1BLD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0S1BLD_131 Jan 2015
PESD5V0S1BLD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0S1BLD_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD5V0S1BLDActiveSOD882DDFN1006D-21 x 0.6 x 0.41Bidirectional35455300.1
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PESD5V0S1BLDSOD882DReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD5V0S1BLD,315 (9340 645 63315)1100 0000PESD5V0S1BLDAlways Pb-free117.00.541.85E911
Low capacitance bidirectional ESD protection diode pesd5v0s1bld
Application guide: ESD protection prtr5v0u2x
The first leadless package with solderable side pads pesd5v0s1uld
PESD5V0S1BLD NXP® Product Reliability pesd5v0s1bld
PESD5V0S1BLD NXP® Product Quality pesd5v0s1bld
PESD5V0S1BLD SPICE model PESD5V0S1BLD
DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BB187LX