MA4FCP305 Flip Chip PIN Diode RoHS Compliant

M/A-COM’s MA4FCP consists of Silicon Flip Chip PIN diodes fabricated with M/A-COM’s patented HMIC process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling. This flip chip configuration is suitable for pick and place insertion.

技术特性 Features
  • Low Resistance : 1.7Ω
  • Low Capacitance : 50fF
  • Fast Switching Speed : 20nS
  • Silicon Nitride Passivation
  • Polyimide Scratch Protection
  • Designed for Automated Pick and Place Insertion
  • Rugged by Design
订购信息 Ordering Information
  • MA4FCP305 Die in Waffle Pack
  • MADP-007161-01269T Tape & Reel
  • MADP-000305-12690R Wafer on Tape Frame
应用领域Applications

The small 0315 outline and low 0.085 pS RC product, make the device useful for multi-throw switch and switched phase shifter circuits requiring <20nS switching speeds up to 18GHz operating frequency.


应用技术支持与电子电路设计开发资源下载 版本信息 大小
MA4FCP305 数据资料DataSheet下载.pdf Rev.V2 2 页