M/A-COM Tech's chip capacitors are used extensively in RF and microwave circuits for commercial and aerospace and defense applications. They are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications up through the Ku-band frequency range. Our chip capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance.
| Capacitance | Standoff | Chip | Pad | ||
|---|---|---|---|---|---|
| Part Number 9 | (pf) | Voltage (V) | Style | Package | Types |
| MA4M1050 MNS MW Chip |
50 | 100 | 132 | Die | Round Bonding Pad |
| MA4M1100 MNS MW Chip |
100 | 100 | 199 | Die | Round Bonding Pad |
| MA4M2020 MNS MW Chip |
20 | 200 | 132 | Die | Round Bonding Pad |
| MA4M2300 MNS MW Chip |
300 | 200 | 263 | Die | Round Bonding Pad |
| MA4M3010 MNS MW Chip |
10 | 200 | 350 | Die | Square Bonding Pad |
| MA4M3030 MNS MW Chip |
30 | 200 | 352 | Die | Square Bonding Pad |
| MA4M3050 MNS MW Chip |
50 | 200 | 354 | Die | Square Bonding Pad |
| MA4M3100 MNS MW Chip |
100 | 50 | 358 | Die | Square Bonding Pad |
| MA4M3150 MNS MW Chip |
150 | 50 | 359 | Die | Square Bonding Pad |
