Laminate UCSP 封装形式产品选型表_BDTIC 代理National Semiconductor 美国国家半导体公司集成电路

Plastic: COG    FBGA    Isolated TO-220    Laminate CSP    Laminate TCSP    Laminate UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    micro SMD    micro SMDXT    micro-ARRAY    mini SOIC    mini SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC narrow    SOIC wide    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TO-220    TO-247 Single Gauge    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    CSOP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99    TO-PMOD

Other: DIE    WAFER

Product Folder (Datasheet)	Description	Status
20-pins
LMX2430SLEX	3.0 GHz/0.8 GHz PLLatinum Dual High Frequency Synthesizer for RF Personal Communications	Full production
LMX2433SLEX	3.6 GHz/1.7 GHz PLLatinum Dual High Frequency Synthesizer for RF Personal Communications	Full production
LMX2434SLEX	5.0 GHz/2.5 GHz PLLatinum Low Power Dual Frequency Synthesizer for RF Personal Communications	Full production
24-pins
Product Folder (Datasheet)	Description	Status
LMX2470SLEX	2.6 GHz Delta-Sigma Fractional-N PLL with 800 MHz Integer-N PLL	Full production