PMEG3005ELD 0.5 A low V_F MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads

产品特点 Features
  • Forward current: IF ≤ 0.5 A
  • Reverse voltage: VR ≤ 30 V
  • Low forward voltage: VF ≤ 500 mV
  • AEC-Q101 qualified
  • Ultra small and leadless SMD plastic package
  • Solderable side pads
  • Package height typ. 0.37 mm
应用
  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch mode power supply
  • Reverse polarity protection
  • Low power consumption applications
产品实物图
PMEG3005ELD 产品实物图
封装
型号 可订购的器件编号 订购码 (12NC) 产品状态 封装
PMEG3005ELD PMEG3005ELD,315 9340 653 38315 量产 SOD882D (DFN1006D-2)
外形图
封装版本 封装名称 封装说明
SOD882D DFN1006D-2 Leadless ultra small plastic package; 2 terminals
订货和供应
型号 订购码 (12NC) 可订购的器件编号 化学成分
PMEG3005ELD PMEG3005ELD,315 9340 653 38315 PMEG3005ELD
PMEG3005ELD 技术支持
档案名称 标题 类型 格式
PMEG3005ELD 0.5 A low V_F MEGA Schottky barrier rectifier Data sheet pdf
AN10117 Medium Power Transistors and Rectifiers for Power Management Applications Application note pdf
75016734 Downsize the footprint, boost the performance; NXP ultra-small diodes and transistors for portable applications Leaflet pdf
75017347 Enabling the Mobile Experience Brochure pdf
相关文档
标题 类型 格式
NXP solutions for consumer and computer interfaces Brochure pdf
Discretes package poster Other type pdf
Definition of Footlength Measurement Method Other type pdf
Reflow soldering footprint Reflow soldering pdf
NXP's Power MOSFET Selection Guide 2013: Smaller, faster, cooler Selection guide pdf
Wave soldering footprint Wave soldering pdf