PMEG3010ET 1 A very low VF MEGA Schottky barrier rectifiers

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages

产品特点 Features
  • Forward current: IF ≤ 1 A
  • Reverse voltage: VR ≤ 30 V
  • Very low forward voltage
  • Small SMD plastic packages
应用
  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch mode power supply
  • Reverse polarity protection
  • Low power consumption applications
产品实物图
PMEG3010ET 产品实物图
封装
型号 可订购的器件编号 订购码 (12NC) 产品状态 封装
PMEG3010ET PMEG3010ET,215 9340 610 49215 量产 SOT23 (TO-236AB)
外形图
封装版本 封装名称 封装说明
SOT23 TO-236AB plastic surface-mounted package; 3 leads
订货和供应
型号 订购码 (12NC) 可订购的器件编号 化学成分
PMEG3010ET PMEG3010ET,215 9340 610 49215 PMEG3010ET
PMEG3010ET 技术支持
档案名称 标题 类型 格式
PMEG3010ET 1 A very low VF MEGA Schottky barrier rectifiers Data sheet pdf
AN10808 Thermal consideration of NXP FlatPower MEGA Schottky barrier rectifiers - Selection criteria Application note pdf
AN10117 Medium Power Transistors and Rectifiers for Power Management Applications Application note pdf
75016734 Downsize the footprint, boost the performance; NXP ultra-small diodes and transistors for portable applications Leaflet pdf
75017347 Enabling the Mobile Experience Brochure pdf
相关文档
标题 类型 格式
NXP solutions for consumer and computer interfaces Brochure pdf
Discretes package poster Other type pdf
Definition of Footlength Measurement Method Other type pdf
Reflow soldering footprint Reflow soldering pdf
NXP's Power MOSFET Selection Guide 2013: Smaller, faster, cooler Selection guide pdf
Wave soldering footprint Wave soldering pdf