技术特性

• UDFN Package with Exposed Drain Pads for Excellent Thermal
  Conduction
  
• Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving
  
• Lowest RDS(on) in 2.0x2.0 Package
  
• ESD Protected
  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
  Compliant

优势

• Excellent Thermal Conduction
• Board Space Saving, Thin Designs
• Minimize Conduction Losses, Reduce Power Loss
• Improved Ruggedness, Increased Reliability
• RoHS Compliance

应用

• High Side Load Switch
• PA Switch and Battery Switch

终端产品

• Power Management Applications for Portable Products, such as Cell Phones, PMP, DSC, GPS, and others

封装图 PACKAGE DIMENSIONS