Patented thermal enhancements are used in the thin shrink, small-outline package (TSSOP), allowing operation over the industrial temperature range. The TSSOP package offers very small board area requirements while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives.
| 器件型号 | 名称 | 产品系列 |
| SN65HVD09 | 9-Channel RS-485 Transceiver | RS-485 |
