TL760M33-Q1 汽车类单输出 LDO、500mA、固定电压 (3.3V)、负载突降保护

TL760M33-Q1
Iout(Max)(A) 0.5  
Iq(Typ)(mA) 8.2  
Vin(Min)(V) 3  
Vin(Max)(V) 26  
Vout(Min)(V) 3.3  
Vout(Max)(V) 3.3  
Fixed Output Options(V) 3.3  
Pin/Package 3DDPAK/TO-263, 3PFM  
Rating Automotive  
Regulated Outputs(#) 1
TL760M33-Q1 描述

The TL760M family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum continuous input voltage of 26 V. Utilizing a pnp pass element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of 500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the TL760M regulators offer very tight output accuracy of ±3% across operating load and temperature ranges. Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection, and overvoltage protection. The TL760M is load-dump protected to its maximum operating condition of 45 V. Stability has been optimized for typical automotive applications and low-cost capacitors. The TL760M family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and 3.3 V.

TL760M33-Q1 特性
TL760M33-Q1 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TL760M33QKTTRQ1 ACTIVE -40 to 125 0.99 | 1ku DDPAK/TO-263 (KTT) | 3 500 TL760M33Q1
TL760M33QKVURQ1 ACTIVE -40 to 125 0.80 | 1ku PFM (KVU) | 3 2500 760M33Q1
TL760M33-Q1 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TL760M33QKTTRQ1 Pb-Free (RoHS)  CU SN  N/A for Pkg Type TL760M33QKTTRQ1 TL760M33QKTTRQ1
TL760M33QKVURQ1 Pb-Free (RoHS)  CU SN  N/A for Pkg Type TL760M33QKVURQ1 TL760M33QKVURQ1
TL760M33-Q1 应用技术支持与电子电路设计开发资源下载
  1. TL760M33-Q1 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LDO低压差线性稳压器驱动器选型与价格参考 . xls
  3. Dual MOSFET Driver (PDF  498 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. LDO PSRR Measurement Simplified   (PDF  140 KB)
  6. LDO Noise Demystified   (PDF  782 KB)
  7. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  8. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  9. 所选封装材料的热学和电学性质 (PDF 645 KB)
  10. 高速数据转换 (PDF 1967 KB)