TPS2551-Q1 可调节的具有电流限制的配电开关

TPS2551-Q1 描述

The TPS2551 power-distribution switch is intended for applications in which heavy capacitive loads and short circuits are likely to be encountered, incorporating a 100-m, N-channel MOSFET in a single package. The current-limit threshold is user adjustable between 100 mA and 1.1 A via an external resistor. The power-switch rise and fall times are controlled to minimize current surges during switching. The device limits the output current to a desired level by switching into a constant-current mode when the output load exceeds the current-limit threshold or a short is present. An internal reverse-voltage detection comparator disables the power-switch in the event that the output voltage is driven higher than the input to protect devices on the input side of the switch

TPS2551-Q1
Vin(Min)(V) 2.5  
Vin(Max)(V) 6.5  
Current Limit(A) 0.1 to 1.1  
Current Limit Accuracy @ 1A +/-30% (700mA min / 1300mA max)  
rDS(on) per FET(Typ)(mOhms) 100/DRV, 85/DBV  
Pin/Package 6SOT-23  
Operating Temperature Range(°C) -40 to 125  
Continuous Current(Max)(A) 1.1  
Number of Switches 1  
Enable Active High  
Rating Automotive  
Current Limit Topology Constant-Current
TPS2551-Q1 特性
TPS2551-Q1 芯片订购指南
器件 状态 温度 (oC) 价格(美元) | Quantity 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPS2551QDBVRQ1 ACTIVE -40 to 125 1.15 | 1ku SOT-23 (DBV) | 6 3000 PIUQ
TPS2551-Q1 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPS2551QDBVRQ1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPS2551QDBVRQ1 TPS2551QDBVRQ1
TPS2551-Q1 应用技术支持与电子电路设计开发资源下载
  1. TPS2551-Q1 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器USB 电源开关产品选型与价格 . xls
  3. PowerPAD™ Thermally Enhanced Package   (PDF  1040 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  6. Comparing Performance of Current Ramp and Voltage Ramp Hot Swap Controller ICs   (PDF  356 KB)
  7. PowerPAD™ Made Easy (PDF 57 KB)
  8. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  9. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  10. 所选封装材料的热学和电学性质 (PDF 645 KB)
  11. 高速数据转换 (PDF 1967 KB)