TPS76933-Q1 汽车类超低功耗 100mA 低压降线性稳压器

TPS76933-Q1
Iout(Max)(A) 0.1  
Vdo(Typ)(mV) 98  
Iq(Typ)(mA) 0.018  
Vin(Min)(V) 3.398  
Vin(Max)(V) 10  
Vout(Min)(V) 3.3  
Vout(Max)(V) 3.3  
Accuracy(%) 3  
Output Capacitor(uF) 4.7  
Output Capacitor Type Tantalum  
Fixed Output Options(V) 3.3  
Pin/Package 5SOT-23  
Rating Automotive  
Regulated Outputs(#)
TPS76933-Q1 描述

The TPS769xx-Q1 family of low-dropout (LDO) voltage regulators offers the benefits of low dropout voltage, ultralow-power operation, and miniaturized packaging. These regulators feature low dropout voltages and ultralow quiescent current compared to conventional LDO regulators. Offered in a 5-terminal small outline integrated-circuit SOT-23 package, the TPS769xx-Q1 series devices are ideal for micropower operations and where board space is at a premium. A combination of new circuit design and process innovation has enabled the usual PNP pass transistor to be replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the dropout voltage is very low, typically 71 mV at 100 mA of load current (TPS76950-Q1), and is directly proportional to the load current.

TPS76933-Q1 特性
TPS76933-Q1 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPS76933QDBVRG4Q1 ACTIVE -40 to 125 0.36 | 1ku SOT-23 (DBV) | 5 3000 PCOQ
TPS76933QDBVRQ1 ACTIVE -40 to 125 0.36 | 1ku SOT-23 (DBV) | 5 3000 PCOQ
TPS76933-Q1 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPS76933QDBVRG4Q1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPS76933QDBVRG4Q1 TPS76933QDBVRG4Q1
TPS76933QDBVRQ1 TBD  CU NIPDAU  Level-1-220C-UNLIM TPS76933QDBVRQ1 TPS76933QDBVRQ1
TPS76933-Q1 应用技术支持与电子电路设计开发资源下载
  1. TPS76933-Q1 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LDO低压差线性稳压器驱动器选型与价格参考 . xls
  3. Dual MOSFET Driver (PDF  498 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. LDO PSRR Measurement Simplified   (PDF  140 KB)
  6. LDO Noise Demystified   (PDF  782 KB)
  7. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  8. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  9. 所选封装材料的热学和电学性质 (PDF 645 KB)
  10. 高速数据转换 (PDF 1967 KB)