Virtex-5 FPGA 器件技术资料下载

Virtex-5 器件数据手册DataSheet 下载
Virtex-5 Package/Device Pinout Files (ASCII) (zip) (application/x-zip-compressed, ver , 201 KB )

All package files are ASCII files in zip format.

Virtex-5 FPGA Data Sheet: DC and Switching Characteristics(PDF, ver 5.3, 2.86 MB )

This data sheet specifies the electrical characteristics of the Virtex®-5 family of FPGAs, including absolute maximum ratings, recommended operating conditions, supply requirements, and switching characteristics.

Virtex-5 系列概述(PDF, ver 5.0, 730 KB )

This document is a brief introduction to the features of the Virtex®-5 devices. It contains the device summary, packaging options, and ordering information.

最新英文版本

Virtex-5 FPGA User Guides 用户手册
Virtex-5 FPGA PCB Designer's Guide(PDF, ver 1.4, 1.3 MB )

This guide provides information on PCB design for Virtex®-5 devices, with a focus on strategies for making design decisions at the PCB and the interface level.

Virtex-5 FPGA System Monitor User Guide(PDF, ver 1.7.1, 3.08 MB )

This guide describes the System Monitor functionality available in all Virtex®-5 devices.

设计文件:

Virtex-5 FPGA Embedded Tri-Mode Ethernet MAC User Guide(PDF, ver 1.10, 5.01 MB )

This user guide describes the dedicated Tri-Mode Ethernet Media Access Controller (MAC) available in Virtex®-5 devices.

Virtex-5 FPGA RocketIO GTP Transceiver User Guide(PDF, ver 1.9, 7.07 MB )

This guide describes the RocketIO™ GTP transceivers available in the Virtex®-5 LXT and SXT devices.

Virtex-5 FPGA RocketIO GTX Transceiver User Guide(PDF, ver 2.1, 6.45 MB )

This guide describes the RocketIO™ GTX transceivers available in the Virtex®-5 TXT and FXT platform devices.

Virtex-5 FPGA Integrated Endpoint Block for PCI Express Designs User Guide(PDF, ver 1.3, 1.78 MB )

This guide describes the functionality of the dedicated PCI Express Endpoint block available in the Virtex®-5 LXT, SXT, and FXT Platforms.

Virtex-5 FPGA Errata 勘误表
Virtex-5 TXT and FXT FPGA Production Errata(PDF, ver 1.0, 56 KB )

Errata for Virtex®-5 TXT and FXT FPGAs.

Virtex-5 XC5VFX30T CES, XC5VFX70T CES, XC5VFX100T CES, XC5VFX130T CES, and XC5VFX200T CES FPGA Errata(PDF, ver 1.3, 146 KB )

Errata for the following Virtex®-5 devices: XC5VFX30T CES, XC5VFX70T CES, XC5VFX100T CES, XC5VFX130T CES, and XC5VFX200T CES FPGAs

Virtex-5 XC5VFX30T, XC5VFX70T, XC5VFX100T, XC5VFX130T, and XC5VFX200T CES9988 FPGA Errata(PDF, ver 1.1, 142 KB )

Errata for the following Virtex®-5 devices: XC5VFX30T, XC5VFX70T, XC5VFX100T, XC5VFX130T, and XC5VFX200T CES9988 FPGA

Virtex-5 XC5VLX30TCES、XC5VLX50TCES、XC5VLX110TCES 和 XC5VLX330TCES 勘误表(PDF, ver 1.3, 175 KB )

下列 Virtex™-5 LXT 器件:XC5VLX30TCES、XC5VLX50TCES、XC5VLX110TCES 和 XC5VLX330TCES 勘误表。

Virtex-5 XC5VSX35TCES 和 XC5VSX50TCES 勘误表(PDF, ver 1.3, 164 KB )

下列 Virtex®-5 SXT 器件:XC5VSX35TCES 和 XC5VSX50TCES 勘误表。

Virtex-5 勘误表:XC5VLX30CES、XC5VLX50CES、XC5VLX85CES、XC5VLX110CES、XC5VLX220CES 和 XC5VLX330CES(PDF, ver 1.6, 144 KB )

Virtex™-5 ES 器件:XC5VLX30CES、XC5VLX50CES、XC5VLX85CES、XC5VLX110CES、XC5VLX220CES 和 XC5VLX330CES 勘误表。

Virtex-5 FPGA Customer Notices 用户注意事项
XCN07021 - Data Sheet Pin-to-Pin Specification Change for the Virtex-5 Family(PDF, ver 1.0, 45 KB )

The purpose of this notification is to communicate a data sheet pin-to-pin specification change for the Virtex™-5 family.

XCN09033 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 67 KB )

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

XCN07025 - Package Substrate Change for Select Virtex-5 LX Devices (PDF, ver 1.0.1, 44 KB )

The purpose of this notification is to communicate a 10-layer package substrate change for select Virtex®-5 LX devices.

设计文件:

XCN07026 - 过渡到所选 Virtex-5 LXT 和 SXT 器件的第 1 步和新封装基片(PDF, ver 1.0.1, 79 KB )

本通告的目的是通知大家已经过渡到了所选 Virtex™-5 LXT 和 SXT 器件的第 1 步和 10 层封装基片。

设计文件:

XCN09012 - Consolidation of On-package Capacitors in Virtex-5 FXT FPGA FF(G)1738 and FF(G)1136 Packages(PDF, ver 1.0, 68 KB )

The purpose of this document is to inform the customer of a standardization effort for on-package capacitors used in Virtex®-5 FXT FPGA FF(G)1738 and FF(G)1136 packages for the prefix “XC” Commercial “C” and Industrial “I” devices.

XCN10013 - Flip Chip Substrates BT to ABF Conversion for Select Virtex-II Pro FPGA Devices(PDF, ver 1.0, 47 KB )

To announce conversion of substrate material changed from BT to ABF build-up for select Virtex®-II Pro FPGA device/package.

Virtex-5 FPGA Application Notes
XAPP858 - High-Performance DDR2 SDRAM Interface in Virtex-5 Devices(PDF, ver 2.2, 1.06 MB )

This application note describes the controller and data capture technique for high-performance DDR2 SDRAM interfaces. This data capture technique uses the Input Serializer/Deserializer (ISERDES) and Output Double Data Rate (ODDR) features available in every Virtex®-5 I/O.

XAPP1018 - Designing Wireless Digital Up/Down Converters Leveraging CORE Generator/System Generator(PDF, ver 1.0, 2.65 MB )

This application note demonstrates how to efficiently implement Digitial Up and Down Converters(DUC/DDC) by leveraging the Xilinx® DSP IP portfolio. Two example DUC/DDC designs are provided for UMTS and CDMA2000 in both Spartan®-3A DSP and Virtex®-5 FPGAs.

设计文件:

XAPP875 - Dynamically Programmable DRU for High-Speed Serial I/O(PDF, ver 1.1, 624 KB )

The non-integer data recovery unit (NI-DRU) presented in this application note is specifically designed for RocketIO™ GTP and GTX transceivers in Virtex®-5 LXT, SXT, TXT, and FXT platforms and consists of look-up tables (LUTs) and flip-flops. The NI-DRU extends the lower data rate limit to 0 Mb/s and the upper limit to 1,250 Mb/s, making embedded high-speed transceivers the ideal solution for true multi-rate serial interfaces.

设计文件:

XAPP1014 - Audio/Video Connectivity Solutions for Virtex-5 FPGAs(PDF, ver 1.2, 23.51 MB )

This application note is a collection of audio and video connectivity solutions for the broadcast industry. It describes how to use Virtex®-5 FPGAs to implement serial digital video and audio interfaces commonly used in the professional video broadcast industry. The associated reference designs support many video rates and standards, and provide for embedded audio.

设计文件:

XAPP866 - An Interface for Texas Instruments Analog-to-Digital Converters with Serial LVDS Outputs(PDF, ver 3.0, 861 KB )

This application note describes how to interface a Texas Instruments analog-to-digital converter (ADC) with serial low-voltage differential signaling (LVDS) outputs to Virtex®-4 or Virtex-5 FPGAs, utilizing the dedicated deserializer functions of both FPGA families.

设计文件:

XAPP864 - SEU Strategies for Virtex-5 Devices(PDF, ver 2.0, 388 KB )

This application note provides a discussion of strategies and representative calculations for handling single event upsets (SEUs) with an emphasis on reliability when addressing these low probability events. This application note also introduces an SEU controller macro that can be included in any Virtex®-5 FPGA design to implement an SEU detection and correction scheme.

XAPP873 - Virtex-5 FPGA Interface for Fujitsu Digital-to-Analog Converters with LVDS Inputs(PDF, ver 1.2, 517 KB )

This application note describes how to interface a Fujitsu MB86064 digital-to-analog converter (DAC) with parallel low-voltage differential signaling (LVDS) inputs to a Virtex®-5 FPGA utilizing the dedicated I/O functions of the FPGA family.

设计文件:

XAPP856 - SFI-4.1 16-Channel SDR Interface with Bus Alignment(PDF, ver 1.2, 1.12 MB )

This Virtex™-5 application note describes an SFI-4.1 interface, a 16-channel, source-synchronous LVDS interface operating at SDR. The transmitter requires 16 LVDS pairs for data and one LVDS pair for the forwarded clock. The receiver also requires 16 LVDS pairs for data and one LVDS pair for the source-synchronous clock input.The timing of the receiver is described in depth and characterized in hardware.

设计文件:

XAPP973 - Indirect Programming of BPI PROMs with Virtex-5 FPGAs(PDF, ver 1.4, 2.1 MB )

This application note describes how to indirectly program select BPI PROMs through the JTAG interface of a Virtex®-5 FPGA using iMPACT. The required hardware setup, BPI-UP PROM file generation, and the indirect programming flow are described.

XAPP1040 - Reference System: PLBv46 Endpoint Bridge for PCI Express in a ML507 Embedded Development Platform(PDF, ver 1.0, 7.54 MB )

This reference system demonstrates the functionality of the PLBv46 Endpoint Bridge for PCI Express® used in the Xilinx ML507 Embedded Development Platform.

设计文件:

XAPP853 - QDR II SRAM Interface for Virtex-5 Devices(PDF, ver 1.3, 409 KB )

This application note describes the implementation and timing details of a four-word burst Quad Data Rate (QDR II) SRAM interface for Virtex®-5 devices.

XAPP137 - Configuring Virtex FPGAs from Parallel EPROMs with a CPLD(PDF, ver 1.0, 81 KB )

Previous generations of Xilinx® FPGAs supported a Master Parallel Configuration Mode which allowed the FPGA to configure itself directly from a parallel (byte wide) PROM. The Virtex® family of Xilinx FPGAs does not utilize a Master Parallel mode. This application note describes a simple interface design to configure a Virtex device from a parallel EPROM using the SelectMAP configuration mode.

设计文件:

XAPP1130 - Architecting ARINC 664, Part 7 (AFDX) Solutions(PDF, ver 1.0, 1.26 MB )

This application note provides an overview of the architecture and function of avionics full-duplex switched Ethernet (AFDX) as defined in the ARINC Specification 664, Part 7. It also describes how to map various functional blocks required for an AFDX end system to the Virtex®-4 and Virtex-5 architectures.

XAPP851 - 使用 Virtex-5 FPGA 器件实现 DDR SDRAM 控制器(中文版)(PDF, ver 1.1, 571 KB )

本应用指南描述了在 Virtex™-5 器件中实现的 200-MHz DDR SDRAM 存储器控制器。 本参考设计使用了 Virtex-5 ChipSync 功能来校准和调整读数据时序。 DDR 提供了一个简单的后端用户接口,使其集成进完整的 FPGA 设计。

设计文件:

最新英文版本

XAPP1022 - Using MET with PIO Example Design for PCI Express Endpoint Cores(PDF, ver 1.0, 1.19 MB )

This application note discusses using the provided Memory Endpoint Test (MET) demonstration driver to exercise the Programmed Input/Output (PIO) design that is delivered with the Endpoint Block Plus Wrapper, Endpoint, and Endpoint PIPE for PCI Express® Xilinx solutions.

设计文件:

XAPP251 - Virtex-II、Virtex-II Pro、Virtex-4 和 Virtex-5 器件的热插拔(PDF, ver 1.3.1, 125 KB )

热插拔是指把未上电的板插到已上电(热)运行系统上的一种潜在危险的方法。 必须注意几点:插拔不能对系统或被插入板造成物理损坏或永久性破坏,而且不能引起数据丢失或任何瞬时系统混乱。 本应用指南从物理方面描述了使用有序接插件将基于 Virtex™-II 的板卡插入系统或系统背板的操作。采用这种方式,在任何信号引脚接触前,VCC 与 GND (地线)可先行良好接触。 热插入部分还介绍了使用普通无序接插件的风险。 此应用指南中未涉及诸如探测卡存在与否或系统对板卡的接纳程度等系统问题。早期中文版

XAPP852 - RLDRAM II Memory Interface for Virtex-5 FPGAs(PDF, ver 2.3, 517 KB )

This application note describes how to use a Virtex™-5 device to interface to Common I/O(CIO) Double Data Rate (DDR) Reduced Latency DRAM (RLDRAM II) devices.

设计文件:

XAPP1117 - Software Debugging Techniques for PowerPC 440 Processor Embedded Platforms(PDF, ver 1.0, 410 KB )

The application discusses the use of the Xilinx® Microprocessor Debugger (XMD) and the GNU software debugger (GDB) to debug software defects.

设计文件:

XAPP653 - 3.3V PCI Design Guidelines(PDF, ver 3.1.1, 196 KB )

Describes the 3.3V PCI solution for the Virtex®-II Pro, Virtex-4, and Virtex-5 FPGA families.

XAPP936 - 连续可变分数率抽取电路(PDF, ver 1.1, 422 KB )

本应用指南重点介绍了正交调幅 (QAM) 信号的基带解调,特别描述了分数率抽取电路模块的使用。 本应用指南也对多相抽取滤波器结构进行了简介,讨论了分数率抽取电路及如何使用 Xilinx System Generator 8.1i 实现它,并给出了实现结果。早期中文版

设计文件:

XAPP1137 - Linux Operating System Software Debugging Techniques with Xilinx Embedded Development Platforms(PDF, ver 1.0, 372 KB )

This application note discusses Linux Operating System debugging techniques. Debugging boot issues, kernel panics, software and hardware debuggers, driver <-> application interaction, and various other tools are discussed.

设计文件:

XAPP867 - High-Performance DDR3 SDRAM Interface in Virtex-5 Devices(PDF, ver 1.0, 255 KB )

This application note describes the controller and the data capture technique for high-performance DDR3 SDRAM interfaces. This data capture technique uses the Input Double Data Rate (IDDR) and Output Double Data Rate (ODDR) features available in every Virtex™-5 FPGA I/O.

设计文件:

XAPP1110 - BFM Simulation of an EDK System Which Uses the PLBv46 Endpoint Bridge for PCI Express(PDF, ver 1.0, 5.48 MB )

This application note demonstrates how to run a simulation of an EDK system containing the PLBv46 Endpoint Bridge for PCI Express®.

设计文件:

XAPP918 - 采用分区技术的增量设计重用(中文版)(PDF, ver 1.0, 1.09 MB )

本应用指南就在增量设计流程中使用分区技术进行了讨论。 建议将逻辑密度高的模块实例、时序关键通路或时序关键模块实例划归为分区。

最新英文版本

XAPP952 - Forward Error Correction on ITU-G.709 Networks using Reed-Solomon Solutions(PDF, ver 1.0, 406 KB )

The ITU-G.709 standard for error correction is examined and implemented in both the Virtex™-4 and Virtex-5 Platform FPGA families using the LogiCORE™ Reed-Solomon (RS) Encoder and Decoder cores.

设计文件:

XAPP870 - Serial ATA Physical Link Initialization with the GTP Transceiver of Virtex-5 LXT FPGAs(PDF, ver 1.0, 1.58 MB )

This application note explains the techniques to support SATA initialization in the GTP transceiver of the Virtex™-5 LXT platform.

设计文件:

XAPP696 - Interfacing LVPECL 3.3V Drivers with Xilinx 2.5V Differential Receivers(PDF, ver 1.3, 324 KB )

This application note describes how to interface 3.3V differential Low-Voltage Positive Emitter Coupled Logic (LVPECL) drivers with Xilinx® 2.5V differential receivers, including Virtex®-II Pro, Virtex-II Pro X, Virtex-4, Virtex-5, Spartan®-3E, and Spartan-3 FPGA 2.5V LVPECL and Low Voltage Differential Signaling (LVDS). Several interface modifications are presented with supporting IBIS simulation results.

XAPP868 - 基于直接数字综合的 E1/T1 的时钟数据恢复设计技巧(PDF, ver 1.0, 287 KB )

本技术文档详细介绍了在针对电信应用的 Virtex™ 和 Spartan™ FPGA 内实现的数字 PLL 的设计方案。对 PLL 的性能和回路稳定性进行了评估。

设计文件:

XAPP863 - Using Digitally Controlled Impedance: Signal Integrity vs Power Dissipation Considerations(PDF, ver 1.0, 1011 KB )

On-die termination (ODT) promises higher signaling rates for printed circuit board (PCB) inter-chip interfaces through improved signal integrity. However, when using ODT, there is sometimes an associated power penalty. This application note explains the reason for the power penalty and suggests a simulation technique for comparing the signal integrity and power dissipation of internally and externally terminated versions of an interface.

设计文件:

XAPP861 - Efficient 8X Oversampling Asynchronous Serial Data Recovery Using IDELAY(PDF, ver 1.1, 287 KB )

Virtex™-5 devices have a high-precision programmable delay element (IDELAY) associated with every input pin. This application note shows how to implement 8X oversampling of many data streams using a single DCM, two global clock resources, and minimal FPGA logic resources. This solution provides better jitter tolerance than techniques using multiple DCMs. When paired with a suitable data recovery scheme, this oversampling technique can be used with many different data protocols up to 550 Mb/s. A reference design is included that implements a SD-SDI (SMPTE 259M) receiver running at 270 Mb/s.

设计文件:

XAPP860 - 16-Channel, DDR LVDS Interface with Real-Time Window Monitoring(PDF, ver 1.1, 831 KB )

This application note describes a 16-channel, source-synchronous DDR LVDS interface. The receiver operates at 1:6 deserialization on each of the 16 data channels. Similar to XAPP855, the design also includes a real-time window monitoring circuit for added performance. This reference design calibrates and compensates for skews associated with process, voltage, and temperature (PVT) at initialization and dynamically during operation.

设计文件:

XAPP938 - PCI-X 和 PCI 设计的动态总线模式重配置应用指南(PDF, ver 1.0, 272 KB )

本应用指南就利用 LogiCORE™ 解决方案实现的 PCI-X 设计的动态总线模式重配置进行了讨论。 它说明了如何在加电之后,利用 CPLD 对 Virtex™-4 和 Virtex-5 FPGA 进行动态的重新加载操作,以便对支持 PCI-X 和 PCI 兼容性的 FPGA 进行动态重配置。

设计文件:

XAPP869 - 使用用于 PCI Express 设计的集成端点模块(中文版)(PDF, ver 1.0, 627 KB )

本应用指南提供了一个关于如何使用 Virtex™-5 LXT FPGA 中用于 PCI Express® 设计的集成端点模块实现点到点(FPGA 到 FPGA)高速串行包传输功能的参考设计。

设计文件:

最新英文版本

XAPP645 - 单纠错和双检错(中文版)(PDF, ver 2.2, 293 KB )

本应用指南描述了“纠错控制”(Error Correction Control, ECC) 模块在 Virtex™-II、Virtex-II Pro、Virtex-4 和 Virtex-5 器件中的实现。 该设计可检测和纠正全部单位元错误 (single bit error)(在由 64 位数据和 8 个校验位或由 32 位数据和 7 个校验位组成的代码字内),并可以检测数据中的双位元错误 (double bit error)。 设计采用的是汉明码 (Hamming code),这是用于 ECC 操作的一种简单而高效的代码。 因此,该设计的性能卓越,并能提供非常高的资源利用率。

设计文件:

最新英文版本

XAPP1111 - Simulation of an EDK System Which Uses the PLBv46 Endpoint Bridge for PCI Express(PDF, ver 1.0, 4.26 MB )

This application note demonstrates how to run a simulation of an EDK system containing the PLBv46 Endpoint Bridge for PCI Express® core. C code running on the PowerPC® 440 drives the EDK system.

设计文件:

XAPP865 - 用于 RAID6 奇偶生成/数据恢复控制器的硬件加速器(PDF, ver 1.0, 944 KB )

描述了用于 RAID6 奇偶生成/数据恢复控制器的硬件加速器,以及 ECC 和 MIG DDR2 控制器。

设计文件:

XAPP1073 - NSEU Mitigation in Avionics Applications(PDF, ver 1.0, 477 KB )

This application note provides background on NSEUs in SRAM-based FPGAs, mitigation techniques (with a focus on configuration memory) suggested by Xilinx, and an overview of calculating projected failures-in-time (FIT) rates at altitude.

XAPP290 - Difference-Based Partial Reconfiguration(PDF, ver 2.0, 305 KB )

This application note describes difference-based partial reconfiguration. This type of reconfiguration is used when making small changes to design parameters including logic equations, filter parameters, and I/O standards.

XAPP877 - SerDes Framer Interface Level 4 Phase 2(PDF, ver , 1.95 MB )

This application note describes the implementation of SerDes Framer Interface Level 4 Phase 2 (SFI4.2) in a Virtex®-5 FPGA XC5VFX70T.

设计文件:

XAPP872 - Creating a Controllable Oscillator Using the Virtex-5 FPGA IODELAY Primitive(PDF, ver 1.0, 1.25 MB )

This application note describes how to use the Virtex®-5 FPGA input/output delay (IODELAY) primitive as a means to create a high-precision adjustable oscillator with a wide tuning range. Three different use models are described for the adjustable oscillator:

设计文件:

XAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller(PDF, ver 4.1, 641 KB )

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

设计文件:

XAPP502 - Using a Microprocessor to Configure Xilinx FPGAs via Slave Serial or SelectMAP Mode(PDF, ver 1.6.1, 356 KB )

In embedded systems, designers can reduce component count and increase flexibility by using a microprocessor to configure an FPGA. C code illustrates the use of either Slave Serial or SelectMAP mode. CPLD design files illustrate a synchronous interface between processor and FPGA.

设计文件:

Virtex-5 FPGA Package Specifications 封装信息
FF1759 - Package Drawing (1759 Ball Flip-Chip BGA)(PDF, ver 1.1, 161 KB )
FFG1156 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA)(PDF, ver 1.1.1, 169 KB )

100% Material Declaration Data Sheet FFG1156

设计文件:

FF1738 - Package Drawing (Standard Flip-Chip Fine Pitch BGA) (application/octet-stream, ver 1.2, 153 KB )
2010/11/12
FFG676 - Material Declaration Data Sheet (Pb-free Flip Chip BGA) (PDF, ver 1.1, 141 KB )

设计文件:

FFG1153 - Material Declaration Data Sheet (Pb-free Flip-Chip Fine Pitch BGA)(PDF, ver 1.1, 79 KB )

设计文件:

FF1760 - Material Declaration Data Sheet (Standard Flip Chip BGA)(PDF, ver 1.1, 68 KB )

设计文件:

FFG1760 - Material Declaration Data Sheet (Pb-free Flip-Chip BGA)(PDF, ver 1.1, 68 KB )

设计文件:

FF323/FFG323 - Package Drawing (Standard BGA Flip-Chip)(PDF, ver 1.1, 75 KB )
FF323 - 材料成份声明数据手册(标准 BGA 倒装片)(PDF, ver 1.0, 63 KB )

设计文件:

  • IPC-1752 Form
FF324 - Material Declaration Data Sheet (Standard Flip-Chip BGA)(PDF, ver 1.0, 38 KB )

设计文件:

  • IPC-1752 Form
FFG324 - 材料成份声明数据手册(标准倒装片 BGA)(PDF, ver 1.0, 38 KB )

设计文件:

FF665 - 材料成份声明数据手册(标准倒装片 BGA)(PDF, ver 1.0, 65 KB )
FF1153 - Material Declaration Data Sheet (Standard Flip-Chip BGA) (PDF, ver 1.1, 78 KB )

设计文件:

  • IPC-1752 Form
FFG323 - 材料成份声明数据手册(标准 BGA 倒装片)(PDF, ver 1.0, 70 KB )
FF676 - Material Declaration Data Sheet (Standard Flip-Chip BGA)(application/octet-stream, ver 1.1, 53 KB )

设计文件:

FFG1136 - 材料成份声明数据手册(无铅塑料倒装片 BGA)(PDF, ver 1.0, 67 KB )
IPC-1752 Form
FFG665 - 材料成份声明数据手册(无铅倒装片 BGA)(PDF, ver 1.0, 83 KB )
FFG1738 - 材料成份声明数据手册(无铅倒装片精确栅距 BGA)(PDF, ver 1.0, 33 KB )
FF1738 - 材料成份声明数据手册(标准倒装片精确栅距 BGA)(PDF, ver 1.0, 90 KB )

设计文件:

  • IPC-1752 Form
FF676 - 封装示意图(标准倒装片 BGA)(PDF, ver 1.1, 123 KB )
FF665 - 封装示意图(标准倒装片 BGA) (PDF, ver 1.0, 114 KB )
FF324 - 封装示意图(标准倒装片 BGA)(PDF, ver 1.0, 63 KB )
FF1153 - 封装示意图(标准倒装片 BGA)(PDF, ver 1.0, 109 KB )
FF1136 - 封装示意图(标准塑料倒装片 BGA) (PDF, ver 1.0, 147 KB )
FF1760 - Package Drawing (Standard Flip Chip BGA)(PDF, ver 1.1, 149 KB )
FF1156 - Package Drawing (Flip-Chip BGA)(PDF, ver 1.1, 144 KB )
Virtex-5 FPGA Characterization Reports 特性描述报告
Virtex-5 FPGA Fibre Channel Protocol Standard Characterization Test Report(PDF, ver 1.0, 731 KB )

This report describes the electrical performance characterization testing of the Virtex™-5 RocketIO™ GTP transceiver against the Fibre Channel specifications.

Virtex-5 CPRI 协议标准特性测试报告(PDF, ver 1.0.1, 3.74 MB )

本报告描述了 Virtex™-5 GTP 收发器相对于通用公共无线电接口 (CPRI) 各项指标的电气特性描述测试。

Virtex-5 PCI Express 协议标准特性测试报告(PDF, ver 1.1, 5.73 MB )

本报告描述了 GTP 收发器相对于 PCI Express 各项指标的电气特性描述测试。

Virtex-5 OC-48 协议标准特性测试报告(PDF, ver 1.0.1, 633 KB )

本报告描述了 GTP 收发器相对于 OC-48 各项指标的电气特性描述测试。

Virtex-5 XAUI 协议标准特性测试报告(PDF, ver 1.0, 2.62 MB )

本报告描述了 GTP 收发器相对于 10 Gb 连接单元接口 (XAUI) 指标的电气性能特性描述测试。

Virtex-5 千兆位级以太网串行协议标准特性测试报告(PDF, ver 1.0.1, 2.36 MB )

本报告描述了 GTP 收发器相对于千兆位级以太网串行协议标准的电气特性描述测试。

Virtex-5 CMT Characterization Report(PDF, ver 1.2, 9.15 MB )

This report documents the results of characterization performed on the Virtex™-5 Clock Management Tile(CMT) that combines two enhanced Digital Clock Managers (DCMs) with one Phase-Locked Loop (PLL), and clocking resources.

Virtex-5 RocketIO GTP 收发器特性描述报告(PDF, ver 1.1, 8.58 MB )

本特性描述报告提供了 Virtex®-5 LXT 和 SXT RocketIO™ GTP 收发器在指定工艺、电压和温度(PVT)条件下的 FPGA 特性描述结果。

Virtex-5 FPGA Serial ATA Generation 2 Protocol Standard Characterization Test Report(PDF, ver 1.0, 1.7 MB )

This report describes the electrical performance characterization testing of the Virtex™-5 RocketIO™ GTP transceiver against the Serial ATA Generation 2 (3 Gb/s) specification.

Virtex-5 GTP Transceiver Interoperability: Virtex-4 RocketIO MGT Characterization Test Report(PDF, ver 1.0.1, 505 KB )

This report communicates the conditions, results, and procedural methods used to achieve a quantified test of interoperation between a Virtex™-5 GTP transceiver and a Virtex-4 RocketIO™ MGT.

Virtex-5 GTP Transceiver Interoperability: Virtex-II Pro RocketIO MGT Characterization Test Report(PDF, ver 1.0, 388 KB )

This report communicates the conditions, results, and procedural methods used to achieve a quantified test of interoperation between a Virtex™-5 GTP transceiver and a Virtex-II Pro RocketIO™ MGT.

Virtex-5 FPGA RocketIO GTX Transceiver CEI-6G Electrical Specification Characterization Report(PDF, ver 1.0, 1.23 MB )

This characterization report compares the electrical performance of the Virtex®-5 FPGA RocketIO™ GTX transceiver against OIF-CEI-02.0, "Common Electrical I/O (CEI) - Electrical and Jitter Interoperability agreements for 6G+ bps and 11G+ bps I/O".

Virtex-5 FPGA GTX Transceiver OC-48 Protocol Standard Characterization Report(PDF, ver 1.0, 1.27 MB )

This characterization report compares the electrical performance of the Virtex®-5 FPGA RocketIO™ GTX transceiver against the GR-253-CORE standard.

Virtex-5 FPGA White Papers 白皮书
产品名称
WP323 - Signal Integrity: Tips and Tricks(PDF, ver 1.0, 159 KB )

This white paper describes design techniques that improve signal integrity in Xilinx FPGAs.

WP280 - Using FPGA Technology to Solve the Challenges of Implementing High-End Networking Equipment: Adding a 100 GbE MAC to Existing Telecom Equipment(PDF, ver 1.0, 152 KB )

This white paper examines the industry's urgent need for higher rate interfaces (particularly 100 GbE), the important risks and concerns that a system architect has when adding 100 GbE to a platform, and several implementation options that show how FPGAs are uniquely positioned to handle these challenges.

WP332 - Meeting DO-254 and ED-80 Guidelines When Using Xilinx FPGAs(PDF, ver 1.0, 205 KB )

This white paper provides a high-level overview of RTCA DO-254 and EUROCAE ED-80 and discusses how Xilinx can assist designers of avionics systems to achieve certification.

WP353 - Seven Steps to an Accurate Worst-Case Power Analysis Using Xilinx Power Estimator (PDF, ver 1.0, 1.77 MB )

This white paper describes the steps necessary to analyze your design's power requirements using the Xilinx® Power Estimator.

WP275 - 取得优先权 - 将您的设计尺寸缩小 50%(PDF, ver 1.0, 239 KB )

本白皮书介绍了一种大家很少注意到的设计技巧。该技巧可以让您的 FPGA 设计尺寸和性能发生重大变化。FPGA 触发器上的控制信号具有优先权。如果您能学会编写符合优先权要求的代码,结果就很有利了。为了解释重点,本白皮书提供了一些简单的 VHDL 和 Verilog 实例。

WP270 - 数字电视广播系统内的前向纠错(PDF, ver 1.0, 833 KB )

本白皮书全面介绍了各种主流数字电视标准,并简要介绍了 Xilinx 提供的针对电缆、卫星、地面和移动系统的相关前向纠错解决方案。

WP262 - 在 Platform Studio 中设计多处理器系统(PDF, ver 1.1, 566 KB )

本白皮书讨论了使用 Xilinx Platform Studio 实现单芯片多处理器设计。

WP284 - Virtex-5 FPGA 六输入 LUT 架构的优势(中文版)(PDF, ver 1.0, 198 KB )

新型 Virtex™-5 架构基于具有双 LUT 功能的真正六输入 LUT,与同类架构相比,在资源占用率方面具有显著优势。本白皮书详述这些优势。

最新英文版本

WP258 - 散热器选择的考虑事项 - Xilinx 热数据应用(PDF, ver 1.0, 135 KB )

本白皮书介绍了与使用传统的单电阻方法选择散热器有关的潜在不准确性问题,并推荐了一种基于器件数据手册中 θ-jc 和 θ-jb 的更准确的双电阻 (2-R) 方法。

WP246 - 65 nm FPGA 功耗(PDF, ver 1.2, 290 KB )

本白皮书专门介绍了 65 nm FPGA 的功耗。

WP260 - 利用 Xilinx FPGA 和存储器接口生成器简化存储器接口(中文版)(PDF, ver 1.0, 1.28 MB )

本白皮书讨论了各种存储器接口控制器设计所面临的挑战和 Xilinx 的解决方案,包括如何使用 Xilinx 软件工具和经过硬件验证的参考设计来为您自己的应用(从低成本的 DDR SDRAM 应用到像 667Mb/s DDR2 SDRAM 这样的更高性能的接口)设计完整的存储器接口解决方案。

最新英文版本

WP245 - 使用 Virtex-5 系列 FPGA 获得更高系统性能(中文版)(PDF, ver 1.1.1, 395 KB )

本文以新型 ExpressFabric™ 技术为重点,说明用 Virtex™-5 系列构建模块所能达到的性能水平。 这里描述了此项新技术的主要功能,包括新型 6 输入 LUT。

最新英文版本

WP248 - 移植到 Virtex-5 FPGA 的指南(中文版)(PDF, ver 1.0, 239 KB )

当将代码从原来的设计移植到 Virtex™-5 平台 FPGA 中时,需要解决某些考虑因素。本白皮书确定并详细介绍了适当的移植指南。

最新英文版本

WP247 - Virtex-5 系列高级封装(PDF, ver 1.0, 558 KB )

本白皮书讨论了 Virtex™-5 系列 FPGA 高级封装方法为应用设计工程师所带来的一些优势。

WP285 - Virtex-5 FPGA 系统功率设计考量(PDF, ver 1.0, 1.42 MB )

本白皮书提供了修改 FPGA 环境、特性和工具选项以便优化系统设计功耗,进而削减热和功率元件成本,提高整个系统的可靠性方面的设计技巧。

WP330 - Infinite Impulse Response Filter Structures in Xilinx FPGAs(PDF, ver 1.0, 433 KB )

This white paper covers the different kinds of IIR filters and structures, and, with the use of The MathWorks® tools, shows how these structures can be mapped to the Xilinx® FPGA architecture.

现在的 PCB 已不再是旧式的 PCB了(PDF, ver 1.0, 54 KB )

本白皮书讨论了 Xilinx FPGA 的信号分析要求和印刷电路板设计方法。

WP360 - Xilinx FPGA Embedded Memory Advantages(PDF, ver 1.0, 443 KB )

The Virtex®-6 and Spartan®-6 architectures feature flexible internal memory resources that can be configured in a variety of different sizes. This white paper details the available features, illustrating the wide array of memory sizes available and shows the trade-off of using different resources to perform memory functions of different sizes.

Virtex-5 FPGA Board and Kit Documentation 开发板套件技术文档
产品名称
Virtex-5 FPGA ML561 Memory Interfaces Development Board User Guide(PDF, ver 1.2.1, 9.6 MB )

This user guide describes the Virtex®-5 FPGA ML561 Memory Interfaces Development Board, which is the heart of the Virtex-5 FPGA ML561 Memory Interfaces Tool Kit. The tool kit provides a complete development platform to interface with external memory devices for designing and verifying applications based on the Virtex-5 LXT Platform.

设计文件:

Virtex-5 LX FPGA Prototype Platform User Guide(application/x-download, ver 1.1.1, 1.47 MB )

This user guide describes the features and operation of the Virtex®-5 LX FPGA prototype platform and provides instructions to configure chains of FPGAs and serial PROMs.

Virtex-5 FXT FPGA PowerPC 440 and MicroBlaze Edition Kit Reference Systems(PDF, ver 1.2.1, 2.19 MB )

This user guide showcases various features of the Virtex®-5 FXT FPGA ML507 development board. It describes the hardware platform, the HelloWorld software application, and the BlueCat Linux images.

设计文件:

ML52x User Guide, Virtex-5 RocketIO Characterization Platform(PDF, ver 2.1, 1.67 MB )

This user guide describes the features and operation of the Virtex®-5 LXT and FXT FPGAs series of RocketIO™ characterization platforms, which includes the ML521, ML523, and ML525 boards.

ML501 Evaluation Platform User Guide(PDF, ver 1.3, 958 KB )

This user guide provides a detailed description of each component and peripheral available on the ML501 Evaluation Platform. The ML501 board is a low-cost, entry-level platform for evaluation of Virtex®-5 LX FPGAs.

Virtex-5 FPGA RocketIO Transceiver Signal Integrity Simulation Kit User Guide(PDF, ver 2.2, 2.44 MB )

This guide describes the Virtex®-5 FPGA RocketIO™ Transceiver Signal Integrity Simulation (SIS) Kit for Synopsys HSPICE.

ML505/ML506/ML507 Getting Started Tutorial(PDF, ver 3.0.2, 940 KB )

The ML505/ML506/ML507 Getting Started Tutorial provides step-by-step instructions for setting up and using the Virtex®-5 ML505, ML506, and ML507 Evaluation Platforms. These boards come with a number of pre-installed demonstrations. This tutorial guides you through these demonstrations and provides instructions to run them on the ML50x boards.

设计文件:

Virtex-5 LXT/SXT/FXT 原型平台用户指南(PDF, ver 3.0.1, 1.63 MB )

本用户指南介绍了 Virtex®-5 LXT、SXT 和 FXT 原型平台的特性与操作方法,并且描述了如何配置 FPGA 链和串行 PROM。

ML501 入门辅导资料(PDF, ver 1.0, 3.38 MB )

本辅导资料针对 Virtex™-5 ML501 评估平台的使用和设置提供渐进说明。 ML501 平台带有许多预装的演示和设置的程序。 这些程序适用于 System ACE 界面、Platform Flash 和 SPI Flash。 本技术文档是从设置到演示的各个步骤对设计者进行了指导。

设计文件:

ML501 参考设计用户指南(PDF, ver 1.0, 155 KB )

本用户指南介绍了几个利用 ML501 评估平台来演示 Virtex™-5 LX 器件特性的设计。

设计文件:

Virtex-5 FPGA ML550 Networking Interfaces Platform User Guide(PDF, ver 1.4, 2.47 MB )

This user guide describes the Virtex®-5 FPGA ML550 Networking Interfaces board, which is the heart of the Virtex-5 FPGA ML550 Source-Synchronous Interfaces Tool Kit.

设计文件:

Xilinx 通用接口 (XGI) SuperClock 模块用户指南(PDF, ver 1.1, 322 KB )

XGI SuperClock 模块用户指南概述了 SuperClock 模块附加板的功能、操作和配置。

Virtex-5 FPGA ML555 Development Kit for PCI and PCI Express Designs User Guide(PDF, ver 1.4, 2.94 MB )

This user guide describes the Virtex™-5 FPGA ML555 Development Kit for PCI and PCI Express designs.