BGS12PL6

The BGS12PL6 general purpose RF MOS power switch is designed to cover a broad range of high power applications from 30 MHz to 4 GHz, mainly in the transmit path of GSM, WCDMA and LTE mobile phones. The symmetric design of its single pole double throw configuration, as shown in Figure 1 (see datasheet) offers high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch’s maximum input power level of 35 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of 0.36 dB in the 1 GHz, 0.46 dB in the 2 GHz and 0.6 dB in the 3 GHz range.

The BGS12PL6 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness.

The device has a very small size of only 0.7x 1.1mm 2 and a low height of 0.31mm. No decoupling capacitors are required in typical applications as long as no DC is applied to any RF port.

Evaluation Board: BGS12PL6 BOARD

ParametricBGS12PL6
Switch TypeSPDT
Control InterfaceGPIO
Frequency Range0.1 - 4
Pmax  max35.0dBm
Insertion Loss (@1GHz)0.36dB
Isolation (@1GHz)37.0dB
Supply Voltage2.4 - 3.6
Budgetary Price €€/1k0.24
Sales Product NameBGS12PL6
OPNBGS12PL6E6327XTSA1
Product Statusactive and preferred
Package NamePG-TSLP-6
Completely lead freeyes
Halogen freeyes
RoHS compliantyes
Packing Size15000
Packing TypeTAPE & REEL
Moisture Level1
Summary of Features:
  • 2 high-linearity TRx paths with power handling capability of up to 35 dBm
  • All ports fully symmetrical
  • Low insertion loss
  • Low harmonic generation
  • High port-to-port isolation
  • 0.1 to 4 GHz coverage
  • High ESD robustness
  • On-chip control logic
  • Very small leadless and halogen free package TSLP-6-4 (0.7x1.1mm 2) with super low height of 0.31 mm
  • No decoupling capacitors required if no DC applied on RF lines
  • RoHS compliant package
Data Sheet
TitleSizeDateVersion
BGS12PL6 - General purpose RF CMOS power SPDT Switch in ultra small package with 0.77mm2 footprint,EN3.6 MB02 六月 201402_04
Application Notes
TitleSizeDateVersion
AN319 - BGS12PL6: SPDT RF CMOS Switch for High Power Applications742 KB01 八月 201301_00
Material Content SheetInfo
TitleSizeDateVersion
MCDS_2015-02-27_08-52-49_MA001113652_PG-TSLP-6-4.pdfEN27 KB31 十月 201301_00
PCB Design Data
TitleSizeDateVersion
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Eagle - v1.0.zipEN2 KB26 五月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Mentor - v1.0.zipEN2 KB26 五月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Cadence - v1.0.zipEN11 KB22 五月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch (for GPS Mobile) - MWO - v2.0.zipEN93 KB14 八月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Altium - v1.0.zip-PCB-v01_00-ENEN506 KB22 五月 201501_00
Evaluation Boards
BoardFamilyDescriptionStatus
BGS12PL6 BOARDRF Switch, RF SwitchBGS12PL6on request
Simulation Models
TitleSizeDateVersion
Infineon-BGS12PL6 - RF Switches (SPxT, DPxT) - SimModel with symbol and footprint AWR MWO v1.0.zipEN4.7 MB31 三月 201601_00
Infineon-RF-Switch-AWR-MWO-Design-Kit-SM-v02_00-ENEN5.5 MB11 十二月 201502_00
Package Data
TitleSizeDateVersion
PG-TSLP-6-4 | BGS12PL6E6327XTSA1EN409 KB11 四月 201601_00
PCB Design Data
TitleSizeDateVersion
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Eagle - v1.0.zipEN2 KB26 五月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Mentor - v1.0.zipEN2 KB26 五月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Cadence - v1.0.zipEN11 KB22 五月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch (for GPS Mobile) - MWO - v2.0.zipEN93 KB14 八月 201501_00
PCB Footprints and Symbols - BGS12PL6 - RF Switch - Altium - v1.0.zip-PCB-v01_00-ENEN506 KB22 五月 201501_00
EN BGS12PL6
AN319 - BGS12PL6: SPDT RF CMOS Switch for High Power Applications BGS12PL6+BOARD
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