BGT70

ParametricBGT70
Frequency71.0-76.0 GHz
Psat (typ)14.0dBm
Rx Gain (typ)20.0dB
NFDSB (typ)8.0dB
ICCRx / Tx350/480 mA @ 3.3V
PN ( @100kHZ typ)-80 dBc/Hz
Power Detector (-)Integrated
Temperature SensorIntegrated
Sales Product NameBGT70
OPNBGT70E6327XTSA1
Product Statusactive and preferred
Package NamePG-WFWLB-119
Completely lead freeyes
Halogen freeyes
RoHS compliantyes
Packing Size1000
Packing TypeTAPE & REEL
Moisture Level1
Summary of Features:
  • Developed for telecommunication only
  • Support FDD and TDD systems (in full duplex or half-duplex mode)
  • Support modulation schemes: QPSK, QAM
  • Support small cell backhaul (up to 1000m)
  • Support Macrocell backhaul (external PA needed depending on output power requirement)
  • Direct conversion I/Q transceiver
  • IF bandwidth 1000MHz
  • Differential RF/IF interface for lower loss and better isolation
  • Integration of VCO (Voltage Controller Oscillator) signal generation
  • PNssb (Phase Noise single side band) < -80dBc/Hz @ 100kHz offset
  • 10dBm linear output power (sufficient for small cells)
  • 7dB NF (Noise Figure)
  • Integrated power detection function
  • Integrated thermal sensor
  • eWLB (embedded Wafer Level Ball Grid Array) packaged device
Benefits:
  • Packaged solution, easy to use and standard SMT flow formounting on customer system
  • Highly integrated RF transceiver requiring no external RF discretes, thereby simplifying the customer design and time-to-market
  • Architecture of Direct Conversion Zero IF eases interface to latest modem/BB designs (no external filter)
  • A transceiver approach with implemented BIST (B uilt-In S elf-T est)on the chip to enable RF testing at Infineon production
  • Family concept (common architecture, package, pinning) simplifies customer designs due to modular approach
Application Notes
TitleSizeDateVersion
AN377 - BGT70 Single-Chip SiGe Transceiver Chipset for E-band Backhaul Applications from 71 to 76 GHz1.6 MB04 七月 201401_00
Product Brief
TitleSizeDateVersion
Infineon-SMT_Ready_E_Band_Radio_Frontend_Design-PB-v01_00-ENEN792 KB01 五月 201501_00
Product Brief - Backhaul Transceiver Chipsets – BGT70 and BGT80436 KB22 九月 2014
Infineon-BGT70_BGT80-PB-v01_00-CNCN7.8 MB28 九月 201501_00
FAQ Document
TitleSizeDateVersion
Frequently asked Questions about mmWave Transceivers308 KB04 七月 201401_00
Article
TitleSizeDateVersion
Infineon-Article_EPR_Feb_2105-ART-v01_00-ENEN1.8 MB13 二月 201501_00
Article - Single-Chip Packaged RF Transceivers for Mobile BackhaulEN965 KB29 七月 2013
Whitepaper
TitleSizeDateVersion
Whitepaper: Millimeter Wave Technology and Test Instrumentation for V-E Band Applications686 KB04 七月 2014
PCB Design Data
TitleSizeDateVersion
PCB Footprints and Symbols - BGT70 - One-chip packaged RF Transceivers for Mobile Backhaul - MWO - v2.0.zipEN179 KB14 八月 201501_00
Package Data
TitleSizeDateVersion
PG-WFWLB-119-1 | BGT70E6327XTSA1EN443 KB11 四月 201601_00
PCB Design Data
TitleSizeDateVersion
PCB Footprints and Symbols - BGT70 - One-chip packaged RF Transceivers for Mobile Backhaul - MWO - v2.0.zipEN179 KB14 八月 201501_00
AN378 - BGT80 Single-Chip SiGe Transceiver Chipset for E-band Backhaul Applications from 81 to 86 GHz BGT80
EN BGT80
Product Brief - Backhaul Transceiver Chipsets – BGT70 and BGT80 BGT80
CN BGT80
Frequently asked Questions about mmWave Transceivers BGT80
EN BGT24MTR12
EN BGT80
Whitepaper: Millimeter Wave Technology and Test Instrumentation for V-E Band Applications BGT80
EN BGT70