F3L200R07PE4

EconoPACK™ 4 650V 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC

ParametricF3L200R07PE4
Configuration3-level
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.55V
HousingEconoPACK™ 4
Sales Product NameF3L200R07PE4
OPNF3L200R07PE4BOSA1
Product Statusactive and preferred
Package NameAG-ECONO4-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size6
Packing TypeTRAY
Summary of Features:
  • Increased blocking voltage capability to 650V
  • Extended Operation Temperature T (vj op)
  • T(vj op) = 150°C
  • V (CEsat) with positive Temperature Coefficient
  • 4 kV AC 1min Insulation
  • High mechanical robustness
  • Integrated NTC temperature sensor
  • Isolated Base Plate
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
功能框图
Data Sheet
TitleSizeDateVersion
F3L200R07PE4 (chinese/english),EN/CN,EN/DE,EN/JA1.1 MB06 三月 201302_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
适配器板驱动板 MA3L080E07_EVAL, EconoPACK4；CN；EN2.3 MB26 八月 2013
驱动板 F3L020E07-F-P_EVAL, EconoPACK4；CN；EN1.5 MB26 八月 2013
安装说明 EconoPACK™4 模块；CN；EN；DE1 MB20 八月 2012
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
3-Level Inverter Modules；EN307 KB27 四月 201608_00
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 四月 201607_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
EconoPACK™4 Power Modules；EN106 KB27 四月 201607_00
Editorials
TitleSizeDateVersion
IGBT Module technology state of the art and future evolutions；EN37 KB07 二月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time；EN191 KB31 一月 2011
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy Systems；EN1.9 MB26 六月 201401_00
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - EconoPACK4；EN58 KB06 一月 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
F3L020E07-F-PIGBT ModulesEvaluation Driver board for 650V 3-level EconoPACK™ 4 modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving 650V EconoPACK™ 4 3-level IGBT Modules (NPC1)on request
MA3L080E07IGBT ModulesEvaluation Adapter Board with booster stage for EconoPACK™ 4 3-Level Modules in NPC1-Topology (650V)For connecting 650V EconoPACK™ 4 IGBT Modules (NPC1) and Driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
F3L200R07PE4 | EconoPACK™4 module | AG-ECONO4-1-1；EN514 KB11 四月 201601_00
EN/CN F3L200R07PE4
EN/DE F3L200R07PE4
EN/JA F3L200R07PE4
EN 1EDI60I12AH
EN 2EDN7524G
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN MA3L080E07
EN MA3L080E07
CN MA3L080E07
EN MA3L120E07
CN FS100R17PE4
EN FS100R17PE4
DE FS100R17PE4
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN F3L2020E12-F-P_EVAL
EN MA3L120E12_EVAL
EN TDB6HK180N16RR_B11
EN IFS100V12PT4
EN FS150R17KE3G
EN DD250S65K3
EN FS50R07U1E4
EN BYM600A170DN2
EN DD250S65K3
EN IDW40E65D2
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN XMC4500-E144X1024+AC
EN IDV20E65D1
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN F3L200R07PE4
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