F4-50R07W2H3_B51 数据手册DataSheet 下载

EasyPACK 2B 650V power module with PressFIT and thermistor. Booster, bypass diode and inverter in one module. Booster: MOSFET CoolMOS? und SiC diode. Inverter: IGBT HighSpeed3.

技术特性Summary of Features:
  • Increased blocking voltage capability to 650V
  • Low VCEsat
  • Al 2O 3 Substrate with Low Thermal Resistance
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
应用领域Target Applications:
    产品优点Benefits:
    • Excellent efficiency and system cost achievable
    订购型号
    Sales Product NameOPNProduct StatusOrder onlinePackage NameTotally lead-freeHalo-freeRoHSPacking SizePacking Type
    F4-50R07W2H3_B51F450R07W2H3B51BOMA1in productionAG-EASY2B-2nonoyes15TRAYS
    数据手册Data Sheet
    F4-50R07W2H3_B51 (japanese/english)1.2 MB06 十一月 2014
    F4-50R07W2H3_B51 (chinese/english)1.2 MB06 十一月 2014
    F4-50R07W2H3_B51 (german/english)976 KB06 十一月 2014
    Application Notes
    Thermische Ersatzschaltbilder300 KB20 六月 2008
    Deadtime calculation for IGBT Modules308 KB06 六月 2008
    Driving IGBTs with unipolar gate voltage389 KB10 二月 2014
    电力电子模块内部NTC的使用586 KB26 十一月 2013
    Series connection of IGBTs28 KB10 二月 2014
    等效热路模型500 KB25 十一月 2013
    如何正确计算并最大限度减小 IGBT 的死区时间1.5 MB26 八月 2013
    New RthCH data sheet values263 KB10 二月 2014
    Using the NTC inside a power module295 KB13 一月 2010
    Paralleling of IGBTs28 KB10 二月 2014
    Industrial IGBT Modules Explanation of Technical Information2.1 MB21 五月 2013
    Application Note IGBT Definition of Junction Temperature84 KB09 四月 2009
    Application of screen print templates to paste thermal grease within IGBT modules489 KB10 二月 2014
    Assembly Instructions - Easy-PressFIT Modules1.4 MB29 四月 2013
    Aging stability of various heatconducting pastes for use with modules without baseplates111 KB10 二月 2014
    Thermal equivalent circuit models (english version)295 KB20 六月 2008
    Editorials
    Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates704 KB31 五月 2014
    Thermal Heat Sink Interface of IGBT Modules w/o Base Plate384 KB07 二月 2014
    The challenge of accurately analyzing thermal resistances1.1 MB31 五月 2014
    Using 650-V High Speed 3 IGBTs in Power Modules for Solar Inverter Performance Improvement1.2 MB11 二月 2014
    Press-Fit Technology, a Solderless Method for Mounting Power Modules377 KB12 二月 2014
    Reliability of PressFIT connections472 KB06 六月 2008
    Impact of module parasitics on the performance of fast-switching devices3.7 MB31 五月 2014
    数据手册Data Sheet
    MCDS - Easy2-B38 KB06 一月 2014
    Application Brochure
    Solutions for Solar Energy Systems1.9 MB26 二月 2014
    Solutions for Industrial Drives2 MB12 五月 2014
    Product Brief
    Easy B-series and Easy750 Power modules351 KB12 五月 2014
    Product Brief - Modules for Photo Voltaic String and Multi-String Inverters473 KB12 五月 2014
    PressFIT - reliable mounting technology807 KB12 五月 2014
    EasyB-系列模块 与Easy750524 KB25 十一月 2013
    Easy & Econo Power Modules660 KB12 五月 2014
    Easy & Econo 模块588 KB25 十一月 2013
    Product Brochure
    Best-in-class products to meet your application demands1.6 MB12 五月 2014
    Product Catalogue
    Shortform Catalog 201448.7 MB19 三月 2014
    Simulation Models
    IPOSIM3.4 MB18 三月 2014
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