FB30R06W1E3

EasyPIM™ 1B 600V PIM IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and NTC.

ParametricFB30R06W1E3
ConfigurationPIM Single Phase Input Rectifier
IC(nom) / IF(nom)30.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.6V
HousingEasyPIM™ 1B
Sales Product NameFB30R06W1E3
OPNFB30R06W1E3BOMA1
Product Statusactive
Package NameAG-EASY1B-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • Low Switching Losses
  • Trench IGBT 3
  • V(CEsat) with positive Temperature Coefficient
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Restistance
  • Compact Design
  • Solder Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FB30R06W1E3 (chinese/english),EN/CN,EN/DE,EN/JA1.1 MB03 十二月 201302_01
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demandsEN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00
Mounting Instructions for EasyPIM™ and EasyPACK ModulesENDE845 KB29 四月 2013
Soldering of Econo and Easy ModulesEN194 KB10 二月 2014
电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013
Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009
E3和T3系列1200V IGBT3 模块的性能差异CNEN330 KB25 十一月 2013
模块的评估驱动板CN2.3 MB25 十一月 2013
等效热路模型CNENDE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014
Series connection of IGBTsEN28 KB10 二月 2014
Paralleling of IGBTsEN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块CNEN588 KB25 十一月 2013
Editorials
TitleSizeDateVersion
Thermal Heat Sink Interface of IGBT Modules w/o Base PlateEN384 KB07 二月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00
Impact of module parasitics on the performance of fast-switching devicesEN3.7 MB31 五月 2014
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial DrivesEN2.4 MB27 四月 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-BEN38 KB06 一月 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
FB30R06W1E3 | EasyPIM™ module | AG-EASY1B-1-1EN607 KB11 四月 201601_00
EN/CN FB30R06W1E3
EN/DE FB30R06W1E3
EN/JA FB30R06W1E3
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS10R12VT3
DE FS25R12W1T4
EN TDB6HK360N16P
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FZ250R65KE3
EN FZ250R65KE3
CN 6ED100E12-F2
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN FS10R12VT3
EN DD250S65K3
EN FS3L25R12W2H3_B11
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN DDB6U75N16W1R_B11
EN IFS75B12N3E4_B32
EN FB30R06W1E3