FS50R12W2T4_B11

EasyPACK 2B 1200V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology

ParametricFS50R12W2T4_B11
ConfigurationSixpack
IC(nom) / IF(nom)50.0A
VCE(sat) (Tvj=25°C typ)1.85V
VF (Tvj=25°C typ)1.7V
HousingEasyPACK 2B
Sales Product NameFS50R12W2T4_B11
OPNFS50R12W2T4B11BOMA1
Product Statusactive and preferred
Package NameAG-EASY2B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size15
Packing TypeTRAY
Summary of Features:
  • Low Switching Losses
  • Trench IGBT 4
  • V(CEsat) with positive Temperature Coefficient
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Compact Design
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FS50R12W2T4_B11 (chinese/english),EN/CN,EN/DE,EN/JA957 KB09 十二月 201302_01
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00
Best-in-class products to meet your application demandsEN1.3 MB27 四月 201608_00
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00
电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013
Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009
Assembly Instructions - Easy-PressFIT ModulesEN1.5 MB29 四月 201302_02
等效热路模型CNENDE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014
Series connection of IGBTsEN28 KB10 二月 2014
Paralleling of IGBTsEN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块CNEN588 KB25 十一月 2013
EasyB-系列模块 与Easy750CNEN524 KB25 十一月 2013
PressFIT - Our established, reliable mounting technologyEN616 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?EN731 KB31 一月 2011
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00
Reliability of PressFIT connectionsEN472 KB06 六月 2008
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current ModulesEN141 KB07 二月 2014
Thermal Heat Sink Interface of IGBT Modules w/o Base PlateEN384 KB07 二月 2014
PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB12 二月 2014
Improving Efficiency in AC drives: Comparison of Topologies and Device TechnologiesEN892 KB31 五月 2014
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014
System Benefits for Solar Inverters using SiC Semiconductor ModulesEN676 KB17 七月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial DrivesEN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) SystemsEN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy2-BEN78 KB06 二月 201503_01
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 三月 2014
EN/CN FS50R12W2T4_B11
EN/DE FS50R12W2T4_B11
EN/JA FS50R12W2T4_B11
EN 1EDI60I12AH
EN IFS75B12N3E4_B32
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS50R07W1E3_B11A
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN TDB6HK180N16RR_B11
EN FP75R17N3E4
EN DD250S65K3
EN FS100R17N3E4_B11
EN FP75R17N3E4
EN FS10R12VT3
EN FS100R17N3E4_B11
EN FF225R12ME4_B11
EN DD250S65K3
EN sic-modules
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FS75R07W2E3_B11A
EN IFS75B12N3E4_B32