P-M2M4.7

Contact-based module, 8 contacts, Epoxy Tape, Wire Bond, Mold

ParametricP-M2M4.7
Product DescriptionContact-based module, 8 contacts, Epoxy Tape, Wire Bond, Mold
Pitch14.25mm
Dimensions12.8 x 10.8mm
Thicknessmax. 600µm
Contact SurfaceCIN+
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesAu surface
Delivery FormsTape on Reel
ApplicationsIndustrial M2M, Consumer M2M
Product NameP-M2M4.7
Summary of Features:
  • 14.25mm
  • 12.8 x 10.8mm
  • max. 600μm
  • CIN+
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface
  • Tape on Reel
Target Applications:
  • Industrial M2M
  • Consumer M2M
Application Brochure
TitleSizeDateVersion
Security for the connected world；EN1.5 MB18 二月 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs Portfolio；EN2.1 MB03 十一月 201511_15
EN S-COM86
EN S-COM86
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