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S-COM8.6

The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.’Coil on Module’ underlines our technology leadership and is based on our extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s systems and requirements.

Parametric S-COM8.6 Product Description Black lined dual interface module, 6 CB Contacts and Coil on Module, Inductive coupling Pitch 14.25mm Dimensions 13 x 11.8mm Thickness max. 470µm Contact Surface NiAu ISO – Reference ISO 7816-1, ISO 7810, ISO 10373-1/-3 Derivatives Au surface, Pd surface Delivery Forms Tape on Reel Applications Payment Product Name S-COM8.6

Summary of Features: 14.25mm 13 x 11.8mm max. 470µm NiAu ISO 7816-1, ISO 7810, ISO 10373-1/-3 Au surface, Pd surface Tape on Reel Target Applications: Payment

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