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S-MFC6.8

With the MFC6.x product series Infineon offers black lined premium Flip Chip packages with an quivalent appearance like epoxy tape. In combination with an optimized card cavtiy this products offer advantages for mechanical robustness, module flatness in card and improved image of card backside in area of module milling cavity. For the Payment market this products are also availabel with palladium surface.

Parametric S-MFC6.8 Product Description Black lined contact-based module; 8 Contacts Pitch 14.25mm Dimensions 13 x 11.8mm Thickness max. 470µm Contact Surface NiAu ISO – Reference ISO 7816-1, ISO 7810, ISO 10373-1/-3 Derivatives Au surface, Pd surface, S-MFC6.8-8-1, S-MFC6.8-8-3 Delivery Forms Tape on Reel Applications Payment, Government Identification Product Name S-MFC6.8

Summary of Features: 14.25mm 13 x 11.8mm max. 470µm NiAu ISO 7816-1, ISO 7810, ISO 10373-1/-3 Au surface, Pd surface, S-MFC6.8-8-1, S-MFC6.8-8-3 Tape on Reel Target Applications: Payment, EMV SDA/DDA, ID

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