Latest Packages

CoolMOS™ in TO-220 FullPAK Wide Creepage
Power Block
CoolMOS™ in SOT-223
ThinPAK 5x6
ThinPAK 8x8
TO-Leadless
power stage 5x6
DirectFET™

OptiMOS™ technology enables for the first time very low R DS(on) values needed for high current applications in space saving packages such as SuperSO8, S3O8 and CanPAK™ and TO-Leadless, which were previously only possible in bulky packages. With the OptiMOS™ 5 Power Block, customers can shrink their designs by at least 50%.

ThinPAK 5x6 package, a new leadless SMD package for CoolMOS™, provides 80 percent volume reduction in comparison to traditional SMD packages such as DPAK. Infineon's CoolMOS™ CE in the new TO-220 FullPAK Wide Creepage package offers an extended creepage by increasing the distance between pins to 4.25mm versus the usual 2.54mm of the widely used TO-220 FullPAK package, reducing cost and additional process steps.

Product Selection Guide
TitleSizeDateVersion
NEW! Power Management Selection Guide 2016EN4.7 MB22 二月 201600_00
Product Brochure
TitleSizeDateVersion
CoolMOS™ Benefits in Hard and Soft SwitchingEN1.5 MB09 六月 201606_16
Product Brief
TitleSizeDateVersion
Product Brief 650V CoolMOS™ C7 Gold in TO-LeadlessEN305 KB09 五月 201601_00
Product Brief 500V 600V 650V 700V CoolMOS™ CE in SOT-223 PackageEN166 KB11 三月 201601_00
Product Brief CoolMOS™ in ThinPAK 5x6234 KB28 四月 2014
Product Brief TO-Leadless PackageEN312 KB13 四月 201401_00
Product Brief - DrBlade518 KB07 八月 2013
Product Brief OptiMOS™ Power stage 3x3235 KB01 二月 2012
Product Brief Power stage 5x6738 KB01 十一月 2012
Product Brief OptiMOS™ D2Pak 7pin257 KB01 十二月 2011
Product Brief CoolMOS™ in ThinPAK 8x8283 KB01 四月 2010
Application Brochure
TitleSizeDateVersion
Application Brochure Battery Powered ApplicationsEN2.1 MB27 二月 201401_00
Application Brochure - Infineon Solutions for TransportationEN6.9 MB01 六月 201300_00
Solutions for Solar Energy SystemsEN1.9 MB26 六月 201401_00
Application Notes
TitleSizeDateVersion
Application Note 650V CoolMOS™ C7 Gold in TO-LeadlessEN2.5 MB10 六月 201601_01
Application Note Introduction to Infineons Power MOSFET Simulation ModelsEN701 KB30 十一月 201501_00
Application Note Introduction to Infineon`s Simulation Models for Power MOSFETs701 KB06 三月 2014
Application Note ThinPAK 5x61.5 MB12 五月 2014
Application Note OptiMOS™ Datasheet ExplanationEN663 KB01 十二月 2012
Application Note Cooling Concepts for CanPAK™934 KB01 三月 2011
Application Note TO-Leadless Package899 KB13 五月 2013
Application Note Evaluation Board 5kW TO-Leadless654 KB17 九月 2013
Application Note Recommendations for Board Assembly of CanPAK™1.1 MB01 三月 2011
Application Note Recommendations for Assembly of Infineon TO Packages993 KB01 四月 2008
Application Note TO-247 4pin - 650V CoolMOS™ C7 Switch in a Kelvin Source Configuration794 KB03 五月 2013
Application Note High Voltage Cooling of thinPAK480 KB01 四月 2012
Application Note Recommendations for Board Assembly of PG-T(S)DSON PackagesEN1.6 MB23 四月 200801_00
Application Note High Voltage Recommendations for PCB Assembly of VDSON Packages (thinPAK 8x8)4.3 MB12 十二月 2013
Application Note Evaluation Board 300W Motor Control Application Kit1.5 MB17 九月 2013
Additional Product Information DrBlade Soldering Guidelines - Recommendations for Printed Circuit Board Assembly of Infineon Laminate Packages523 KB08 五月 2013
Presentations
TitleSizeDateVersion
Product Presentation TO-Leadless Package - Optimized for high current applications1.6 MB08 五月 2013
Presentation - OptiMOS™ the perfect fit for your battery powered application2.2 MB20 五月 2014
Article
TitleSizeDateVersion
Article Electronic Specifier TO-Leadless MOSFET PackageEN699 KB10 六月 201501_00
Infineon-Article CoolMOS™ in ThinPAK 5x6 PSD Magazine-ART-v01_00-ENEN1.7 MB20 十月 201401_00
Additional Product Information
TitleSizeDateVersion
Advertisement TO-Leadless Package EnglishEN392 KB04 十月 2013
Advertisement TO-Leadless Package GermanDE389 KB04 十月 2013
Press Release ThinPAK 5x6 - EnglishEN94 KB14 五月 2014
Press Release ThinPAK 5x6 - GermanDE97 KB14 五月 2014
Press Release TO-247 4 pin Package EnglishEN105 KB06 五月 2013
Press Release TO-247 4 pin Package GermanDE109 KB06 五月 2013
Press Release DrBlade 1 GermanDE114 KB01 三月 201301_00
Press Release OptiMOS™ 5 25V 30V English.pdfEN157 KB12 三月 201501_00
Simulation Models
TitleSizeDateVersion
Simulation Model OptiMOS™ Power MOSFET PSpice 60V N-ChannelEN1.1 MB28 八月 201501_00
EN IDV20E65D1
EN thinpak-8x8
EN optimos-tm-in-to-leadless
EN sot-223
Product Brief CoolMOS™ in ThinPAK 5x6 thinpak-5x6
EN optimos-tm-in-to-leadless
Product Brief - DrBlade TDA21310
Product Brief OptiMOS™ Power stage 3x3 power-stage-3x3-and-5x6
Product Brief Power stage 5x6 power-stage-3x3-and-5x6
Product Brief OptiMOS™ D2Pak 7pin latest-packages
Product Brief CoolMOS™ in ThinPAK 8x8 thinpak-8x8
EN optimos-tm-in-to-leadless
EN power-stage-3x3-and-5x6
EN IDW40E65D2
EN optimos-tm-in-to-leadless
EN power-stage-3x3-and-5x6
LEDs from 10ma to 700mA driven by BCR4XX (AN101) BC817SU
Application Note ThinPAK 5x6 thinpak-5x6
EN power-stage-3x3-and-5x6
Application Note Cooling Concepts for CanPAK™ latest-packages
Application Note Evaluation Board 5kW TO-Leadless optimos-tm-in-to-leadless
Application Note Recommendations for Board Assembly of CanPAK™ latest-packages
Application Note Recommendations for Assembly of Infineon TO Packages latest-packages
Application Note TO-247 4pin - 650V CoolMOS™ C7 Switch in a Kelvin Source Configuration latest-packages
Application Note High Voltage Cooling of thinPAK thinpak-8x8
EN latest-packages
Application Note High Voltage Recommendations for PCB Assembly of VDSON Packages (thinPAK 8x8) thinpak-8x8
Application Note Evaluation Board 300W Motor Control Application Kit latest-packages
Additional Product Information DrBlade Soldering Guidelines - Recommendations for Printed Circuit Board Assembly of Infineon Lam TDA21320
Product Presentation TO-Leadless Package - Optimized for high current applications optimos-tm-in-to-leadless
Presentation - OptiMOS™ the perfect fit for your battery powered application optimos-tm-in-to-leadless
EN optimos-tm-in-to-leadless
EN thinpak-5x6
EN optimos-tm-in-to-leadless
DE optimos-tm-in-to-leadless
EN thinpak-5x6
DE thinpak-5x6
EN latest-packages
DE latest-packages
DE TDA21310
EN TDA21220
EN optimos-tm-in-to-leadless