smart card dual-interface module

ProductProduct DescriptionPitchDimensionsThicknessContact Surface
T-M8.8Dual Interface Module, 8 contacts CB, 2 Antenna contacts, Epoxy Tape, Wire Bond, Glob Top14.25 mm13 x 11.8mmmax. 580μmAu
S-COM10.6Dual Interface Module with inductive coupling for highly demanding applications14.25 mm13 x 11.8mmmax. 420µmAu
T-M8.4Dual Interface Module, 8 Contacts CB, 2 Antenna Contacts, Epoxy Tape, Wire Bond, Glob Top14.25 mm13 x 11.8mmmax. 580μmCIN
P-M8.4Dual Interface Module, 8 Contacts CB, 2 Antenna Contacts, Epoxy Tape, Wire Bond, Mold14.25 mm13 x 11.8mmmax. 620μmCIN
S-COM8.6Black lined dual interface module, 6 CB Contacts and Coil on Module, Inductive coupling14.25 mm13 x 11.8mmmax. 470µmNiAu