1PSxSB17: 4 V、30 mA低C_d肖特基势垒二极管 _ BDTIC 中国领先电子元器件代理商

1PSxSB17: 4 V、30 mA低C_d肖特基势垒二极管

平面低电容肖特基势垒二极管封包在极小的SMD塑料封装中。

1PSXSB17: 产品结构框图

1PSXSB17: 应用结构框图

1PSXSB17: 应用结构框图

1PSXSB17: 应用结构框图

sod523_3d

数据手册 (1)

名称/描述	Modified Date
4 V, 30 mA low C_d Schottky barrier diode (REV 6.0) PDF (50.0 kB) 1PSXSB17 [English]	04 Apr 2005

选型工具指南 (1)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016

封装信息 (3)

名称/描述	Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 [English]	08 Feb 2016
plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English]	08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English]	08 Feb 2016

包装 (3)

名称/描述	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English]	29 Nov 2012
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 [English]	07 Nov 2012
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English]	07 Nov 2012

可靠性与质量信息 (6)

名称/描述	Modified Date
1PS66SB17 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS66SB17 [English]	31 Jan 2015
1PS66SB17 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS66SB17_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
1PS76SB17 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS76SB17 [English]	31 Jan 2015
1PS76SB17 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS76SB17_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
1PS79SB17 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS79SB17 [English]	31 Jan 2015
1PS79SB17 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS79SB17_NXP_PRODUCT_QUALITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

1PS66SB17 SPICE model (REV 1.4) prm 1PS66SB17_1 7/22/2012
1PS76SB17 SPICE model (REV 1.4) prm 1PS76SB17_1 7/22/2012
1PS79SB17 SPICE model (REV 1.4) prm 1PS79SB17_1 7/22/2012

订购信息

型号	状态
1PS66SB17	Active
1PS76SB17	Active
1PS79SB17	Active

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
1PS79SB17		SOD523	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	1PS79SB17,115 (9340 580 74115)	T2	1PS79SB17		Always Pb-free	157.0	0.73	1.37E9	1	1
1PS76SB17		SOD323	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	1PS76SB17,115 (9340 454 00115)	S7	1PS76SB17		week 31, 2003	157.0	0.73	1.37E9	1	1
1PS66SB17		SOT666	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	1PS66SB17,115 (9340 587 43115)	N2	1PS66SB17		Always Pb-free	157.0	0.73	1.37E9	1	1

4 V, 30 mA low C_d Schottky barrier diode 1PS79SB17

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

1PS66SB17 NXP® Product Reliability 1PS66SB17

1PS66SB17 NXP Product Quality 1PS66SB17

1PS76SB17 NXP® Product Reliability 1PS76SB17

1PS76SB17 NXP Product Quality 1PS76SB17

1PS79SB17 NXP® Product Reliability 1PS79SB17

1PS79SB17 NXP Product Quality 1PS79SB17

1PS66SB17 SPICE model 1PSXSB17

1PS76SB17 SPICE model 1PSXSB17

1PS79SB17 SPICE model 1PSXSB17

plastic surface-mounted package; 2 leads pesd5z7.0

Tape reel; standard product orientation 12NC ending 115 pesd5z7.0

plastic surface-mounted package; 2 leads pesd5v0v1ba

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba

plastic surface-mounted package; 6 leads BSS84AKV

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV

1PSXSB17

1PSXSB17

1PSXSB17

1PSXSB17

BB208-02

BB208-03

1PSXSB17

©1993 - 2024 BDTIC