2PA1774SM: PNP通用晶体管

PNP通用晶体管,采用SOT883无引脚超小型塑料封装。

NPN补充产品:2PC4617M系列。

SOT883
数据手册 (1)
名称/描述Modified Date
PNP general purpose transistor (REV 1.0) PDF (129.0 kB) 2PA1774M_SERIES [English]19 Feb 2004
封装信息 (1)
名称/描述Modified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
2PA1774SM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774SM [English]31 Jan 2015
2PA1774SM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774SM_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementConfigurationIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]fr [min] (MHz)hFE [min]
2PA1774SMActiveSOT883DFN1006-31.0 x 0.6 x 0.54301-100PNP-40560270
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
2PA1774SMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActive2PA1774SM,315 (9340 571 44315)PC2PA1774SMAlways Pb-free153.00.711.41E911
PNP general purpose transistor 2PA1774SM
2PA1774SM NXP® Product Reliability 2PA1774SM
2PA1774SM NXP Product Quality 2PA1774SM
2PA1774SM SPICE model 2PA1774SM
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PMZ950UPE