74AUP1G16GM: Low-power buffer

The 74AUP1G16 provides a low-power, low-voltage single buffer.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Outline 3d SOT886
数据手册 (1)
名称/描述Modified Date
Low-power buffer (REV 2.0) PDF (162.0 kB) 74AUP1G16 [English]07 Oct 2016
封装信息 (1)
名称/描述Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
IBIS
订购信息
型号状态FamilyVCC (V)Logic switching levels说明Output drive capability (mA)fmax (MHz)No of bitstpd (ns)Power dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pinsPackage version
74AUP1G16GMActiveAUP1.1 - 3.6CMOSdual buffer/line driver (3-state)+/- 1.97013.9ultra low-40~1253117.7157XSON66SOT886
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
74AUP1G16GMSOT886Reflow_Soldering_ProfileReel 7" Q3/T4, ReverseActive74AUP1G16GMH (9353 075 35125)Standard Marking74AUP1G16GMAlways Pb-free11
Low-power buffer 74AUP1G16GM
MAR_SOT886 Topmark prtr5v0u2f
74AUP1G16 IBIS model 74AUP1G16GM
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BGU8007