74AXP1G00GM: Low-power 2-input NAND gate

The 74AXP1G00 is a single 2-input NAND gate.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

74AXP1G00GM: 产品结构框图
Outline 3d SOT886
数据手册 (1)
名称/描述Modified Date
Low-power 2-input NAND gate (REV 1.0) PDF (181.0 kB) 74AXP1G00 [English]24 Sep 2014
选型工具指南 (2)
名称/描述Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]08 Jan 2015
封装信息 (1)
名称/描述Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
IBIS
订购信息
型号状态Family功能VCC (V)Logic switching levels类型说明Package versionOutput drive capability (mA)tpd (ns)fmax (MHz)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pins
74AXP1G00GMActiveAXPNAND gates0.7 - 2.75CMOSNAND gatessingle 2-input NAND gateSOT886+/- 4.52.7701ultra low-40~853228.3164XSON66
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
74AXP1G00GMSOT886Reflow_Soldering_ProfileReel 7" Q3/T4, ReverseActive74AXP1G00GMH (9353 040 77125)Standard Marking74AXP1G00GMAlways Pb-free11
Low-power 2-input NAND gate 74AXP1G00GX
ロジック製品セレクションガイド... 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
MAR_SOT886 Topmark prtr5v0u2f
74AXP1G00 IBIS model 74AXP1G00GX
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
74AVCM162836DGG
BGU8007