74HC00DB: 四路2输入与非门

74HC00;74HCT00是符合JEDEC标准no. 7A的高速硅栅CMOS器件。它们与低功耗肖特基TTL (LSTTL)针脚兼容。

74HC00;74HCT00提供四路2输入与非功能。

Outline 3d SOT337-1
数据手册 (1)
名称/描述Modified Date
Quad 2-input NAND gate (REV 7.0) PDF (176.0 kB) 74HC_HCT00 [English]25 Nov 2015
应用说明 (2)
名称/描述Modified Date
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English]13 Mar 2013
Pin FMEA 74HC/74HCT family (REV 1.0) PDF (51.0 kB) AN11044 [English]16 Mar 2011
用户指南 (1)
名称/描述Modified Date
HC/T User Guide (REV 1.0) PDF (508.0 kB) HCT_USER_GUIDE [English]01 Nov 1997
封装信息 (1)
名称/描述Modified Date
plastic shrink small outline package; 14 leads; body width 5.3 mm (REV 1.0) PDF (295.0 kB) SOT337-1 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Standard product orientation 12NC ending 118 (REV 1.0) PDF (86.0 kB) SOT337-1_118 [English]04 Apr 2013
支持信息 (2)
名称/描述Modified Date
Footprint for reflow soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]08 Oct 2009
Design Support
SPICE
订购信息
型号状态Family功能VCC (V)类型说明Logic switching levelsOutput drive capability (mA)Package versiontpd (ns)fmax (MHz)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pins
74HC00DBActiveHC(T)NAND gates2.0 - 6.0NAND gatesquad 2-input NAND gateCMOS+/- 5.2SOT337-17364low-40~12515640.0SSOP1414
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74HC00DBSOT337-1SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE
SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1Active74HC00DB,118 (9351 741 20118)HC0074HC00DBweek 12, 200584.96.621.51E811
Bulk PackActive74HC00DB,112 (9351 741 20112)HC0074HC00DBweek 12, 200584.96.621.51E811
Quad 2-input NAND gate 74HCT00PW
Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
Pin FMEA 74HC/74HCT family 74HC_T_597_Q100
HC/T User Guide 74HCU04PW
D12EPP_Sch_Ver1_0_1 74HCT32PW
hc Spice model 74HCU04PW
plastic shrink small outline package; 14 leads; body width 5.3 mm 74LVC32A_Q100
Footprint for reflow soldering 74HC_T_595_Q100
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
Standard product orientation 12NC ending 118 74LVC32A_Q100
74LV164