74LVC1G18: 2选1非反相解复用器，具有3态取消选定输出
74LVC1G18是带3态输出的2选1非反相解复用器。该器件缓冲输入针脚A上的数据并将其传输到输出1Y或2Y，具体取决于选择输入(针脚S)的状态是低电平还是高电平。输入可通过3.3 V或5 V器件进行驱动。该特性允许在混合3.3 V和5 V环境中使用这些器件。
该器件完全适合使用IOFF的局部掉电应用。IOFF电路可禁用输出，防止断电时破坏性回流电流通过该器件。
74LVC1G18: 产品结构框图
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 1-of-2 non-inverting demultiplexer with 3-state deselected output (REV 2.0) PDF (76.0 kB) 74LVC1G18 [English] | 30 Aug 2007 |
应用说明 (5)
| 名称/描述 | Modified Date |
|---|---|
| Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
| Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
| Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English] | 04 Feb 2011 |
| MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
| PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English] | 30 Oct 2002 |
封装信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
支持信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
IBIS
- 74LVC1G18 IBIS model (REV 1.0) ibs LVC1G18 10/21/2014
订购信息
| 型号 | 状态 |
|---|---|
| 74LVC1G18GV | Active |
| 74LVC1G18GW | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G18GV |  | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74LVC1G18GV,125 (9352 737 82125) | V18 | 74LVC1G18GV |    | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
| 74LVC1G18GW | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74LVC1G18GW,125 (9352 737 81125) | VW | 74LVC1G18GW | | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
- Sorting through the low voltage logic maze 74LVC_H_245A_Q100
- Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
- Pin FMEA for LVC family 74LVC1G123_Q100
- MicroPak soldering information NTS0102_Q100
- PicoGate Logic footprints NX3L4684
- MAR_SOT363 Topmark BSS84AKS
- MAR_SOT457 Topmark 74LVC2G17_Q100
- 74LVC1G18 IBIS model 74LVC1G18GW
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- 74LVC1G18
- SSL5021_SSL5031
- BFU520Y
