74LVC1G386: 3输入异或门

74LVC1G386提供一个3输入异或功能。

输入可通过3.3或5 V器件进行驱动。该特性允许在混合3.3 V和5 V环境中使用这些器件。

所有输入处的施密特触发器动作使电路容许较慢的输入上升和下降时间。

该器件完全适合使用IOFF的局部掉电应用。IOFF电路可禁用输出,防止掉电时破坏性回流电流通过该器件。

74LVC1G386: 产品结构框图
SOT363
数据手册 (1)
名称/描述Modified Date
3-input EXCLUSIVE-OR gate (REV 2.0) PDF (72.0 kB) 74LVC1G386 [English]29 Jun 2016
应用说明 (5)
名称/描述Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]13 Mar 2013
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English]04 Feb 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]30 Oct 2002
封装信息 (2)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English]30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]20 Nov 2012
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]03 Jun 2013
IBIS
订购信息
型号状态
74LVC1G386GVActive
74LVC1G386GWActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74LVC1G386GVSOT457Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74LVC1G386GV,125 (9352 749 98125)YH74LVC1G386GVAlways Pb-free123.83.872.58E811
74LVC1G386GWSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74LVC1G386GW,125 (9352 749 97125)YH74LVC1G386GWAlways Pb-free123.83.872.58E811
3-input EXCLUSIVE-OR gate 74LVC1G386GW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
Pin FMEA for LVC family 74LVC1G123_Q100
MicroPak soldering information NTS0102_Q100
PicoGate Logic footprints NX3L4684
MAR_SOT363 Topmark BSS84AKS
MAR_SOT457 Topmark 74LVC2G17_Q100
74LVC1G386 IBIS model 74LVC1G386GW
plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
74LVC1G386
SSL5021_SSL5031
BFU520Y