74LVC1G97: 低功耗可配置多功能门

74LV4094是低压硅栅CMOS器件,与74HC4094、74HCT4094引脚和功能兼容。74LVC1G97是带施密特触发器输入的可配置多功能逻辑门。 该器件可配置为下列任何逻辑函数:“多路复用”、“与”、“或”、“与非”、“或非”、反相器和缓冲器;使用3位输入。所有输入可连接至VCC或GND。

输入可从3.3 V器件或5 V器件驱动。该特性允许在3.3 V和5 V混合电压环境中将这些器件用作转换器。

该器件完全指定用于使用IOFF的部分掉电应用。IOFF电路可禁用输出,从而防止掉电时电流回流对器件造成的损坏。

SOT363
数据手册 (1)
名称/描述Modified Date
Low-power configurable multiple function gate (REV 4.0) PDF (224.0 kB) 74LVC1G97 [English]10 Sep 2014
应用说明 (4)
名称/描述Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]13 Mar 2013
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English]04 Feb 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
手册 (1)
名称/描述Modified Date
Low voltage CMOS family - LVC (REV 1.0) PDF (2.6 MB) 75017668 [English]10 Jul 2015
封装信息 (6)
名称/描述Modified Date
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]08 Feb 2016
包装 (6)
名称/描述Modified Date
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]26 Aug 2014
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1115_132 [English]04 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]04 Apr 2013
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English]30 Nov 2012
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]20 Nov 2012
支持信息 (8)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]03 Jun 2013
IBIS
订购信息
型号状态
74LVC1G97GSActive
74LVC1G97GNActive
74LVC1G97GWActive
74LVC1G97GVActive
74LVC1G97GFActive
74LVC1G97GMActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74LVC1G97GMSOT886Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74LVC1G97GM,132 (9352 931 86132)YV74LVC1G97GMAlways Pb-free123.83.872.58E811
74LVC1G97GFSOT891Reflow_Soldering_ProfileReel 7" Q1/T1, Q3/T4Active74LVC1G97GF,132 (9352 931 85132)YV74LVC1G97GFAlways Pb-free123.83.872.58E811
74LVC1G97GNSOT1115Reel 7" Q1/T1, Q3/T4Active74LVC1G97GN,132 (9352 931 87132)YV74LVC1G97GNAlways Pb-free123.83.872.58E811
74LVC1G97GVSOT457Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74LVC1G97GV,125 (9352 931 89125)Y9774LVC1G97GVAlways Pb-free123.83.872.58E811
74LVC1G97GWSOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActive74LVC1G97GW,125 (9352 931 91125)YV74LVC1G97GWAlways Pb-free123.83.872.58E811
74LVC1G97GSSOT1202Reel 7" Q1/T1, Q3/T4Active74LVC1G97GS,132 (9352 931 88132)YV74LVC1G97GSAlways Pb-free123.83.872.58E811
Low-power configurable multiple function gate 74LVC1G97GW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
Pin FMEA for LVC family 74LVC1G123_Q100
MicroPak soldering information NTS0102_Q100
Low voltage CMOS family - LVC 74LVC_H_245A_Q100
MAR_SOT1115 Topmark 74AUP1G332
MAR_SOT1202 Topmark NCX2200GS
MAR_SOT363 Topmark BSS84AKS
MAR_SOT457 Topmark 74LVC2G17_Q100
MAR_SOT886 Topmark prtr5v0u2f
MAR_SOT891 Topmark prtr5v0u2k
74LVC1G97 IBIS model 74LVC1G97GW
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
XSON6; reel pack; standard product orientation; 12NC ending 132 NCX2200GM
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k
XSON6; reel pack; standard product orientation; 12NC ending 132 prtr5v0u2k
SOT1115 74AUP1G332
Reel 7" Q1/T1, Q3/T4 74AUP1G332
plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS
Reversed product orientation 12NC ending 132 NTS0101
BGU8007
BGU7003
74LVC2G17
SSL5021_SSL5031
BFU520Y
74LVC2G17