BC52PA: 60 V,1 A PNP中等功率晶体管

PNP中等功率晶体管,采用SOT1061无引脚超小型表面贴装器件(SMD)塑料封装。NPN补充产品:BC55PA。

Outline 3d SOT1061
数据手册 (1)
名称/描述Modified Date
60 V, 1 A PNP medium power transistors (REV 9.0) PDF (1.1 MB) BCP52_BCX52_BC52PA [English]07 Nov 2011
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (1)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BC52PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC52PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC52PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC52PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)ComplementPtot (mW)IC [max] (mA)IC max (mA)PolarityPtot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]hFE [min]
BC52PAActiveSOT1061DFN2020-32 x 2 x 0.65BC55PA1000PNP16506014525040
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC52PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC52PA,115 (9340 658 17115)BSBC52PAAlways Pb-free153.00.711.41E911
60 V, 1 A PNP medium power transistors BCX52-16
Medium-power general-purpose transistors BSR43
BC52PA NXP Product Quality BC52PA
BC52PA NXP® Product Reliability BC52PA
BC52PA SPICE model BCP52_BCX52_BC52PA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES