BC848 series: 30 V，100 mA NPN通用晶体管 _ BDTIC 中国领先电子元器件代理商

BC848 series: 30 V，100 mA NPN通用晶体管

NPN通用晶体管，采用表面贴装器件(SMD)塑料封装。

BC848_SERIES: 产品结构框图

BC848_SERIES: 应用结构框图

SOT323

数据手册 (1)

名称/描述	Modified Date
30 V, 100 mA NPN general-purpose transistors (REV 7.0) PDF (124.0 kB) BC848_SER [English]	07 Dec 2009

封装信息 (2)

名称/描述	Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]	08 Feb 2016
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]	08 Feb 2016

包装 (5)

名称/描述	Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]	05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English]	16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]	16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]	16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 [English]	16 Nov 2012

可靠性与质量信息 (4)

名称/描述	Modified Date
BC848B NXP Product Quality (REV 1.2) PDF (74.0 kB) BC848B_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
BC848B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC848B_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015
BC848W NXP Product Quality (REV 1.2) PDF (74.0 kB) BC848W_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
BC848W NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC848W_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999

SPICE

BC848B SPICE model (REV 1.4) prm BC848B 7/22/2012
BC848W SPICE model (REV 1.4) prm BC848W 7/22/2012

订购信息

型号	状态
BC848W	Active
BC848B	Active

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
BC848W		SOT323	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	BC848W,115 (9340 220 60115)	1M%	BC848W		week 30, 2003	153.0	0.71	1.41E9	1	1
BC848W		SOT323	Reflow_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BC848W,135 (9340 220 60135)	1M%	BC848W		week 30, 2003	153.0	0.71	1.41E9	1	1
BC848B		SOT23	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4	Active	BC848B,215 (9335 896 30215)	1K%	BC848B		week 34, 2003	153.0	0.71	1.41E9	1	1
BC848B		SOT23		Reel 11" Q3/T4, LargePack	Active	BC848B,235 (9335 896 30235)	1K%	BC848B		week 34, 2003	153.0	0.71	1.41E9	1	1

30 V, 100 mA NPN general-purpose transistors BC848W

Tape reel SMD; standard product orientation 12NC ending 185 BAT54S

BC848B NXP Product Quality BC848B

BC848B NXP® Product Reliability BC848B

BC848W NXP Product Quality BC848W

BC848W NXP® Product Reliability BC848W

Letter Symbols - Transistors; General PEMD16

BC848B SPICE model BC848B

BC848W SPICE model BC848W

plastic surface-mounted package; 3 leads BSS84AKW

Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW

Tape reel SMD; standard product orientation 12NC ending 135 BAT854CW

plastic surface-mounted package; 3 leads BSS84AK

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK

Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK

PMBTA45

BAV99_SERIES

PRF947

PMBFJ309

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