BC849; BC850: NPN通用晶体管

NPN晶体管,采用SOT23塑料封装。

PNP补充产品:BC859和BC860。

SOT023
数据手册 (1)
名称/描述Modified Date
NPN general purpose transistors (REV 6.0) PDF (134.0 kB) BC849_BC850 [English]16 Jan 2004
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (8)
名称/描述Modified Date
BC849B NXP Product Quality (REV 1.2) PDF (74.0 kB) BC849B_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC849B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC849B_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC849C NXP Product Quality (REV 1.2) PDF (74.0 kB) BC849C_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC849C NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC849C_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC850B NXP Product Quality (REV 1.2) PDF (74.0 kB) BC850B_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC850B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC850B_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC850C NXP Product Quality (REV 1.2) PDF (74.0 kB) BC850C_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC850C NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC850C_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态
BC849BActive
BC850BActive
BC849CActive
BC850CActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC850CSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBC850C,235 (9335 897 00235)2G%BC850Cweek 34, 2003153.00.711.41E911
Reel 7" Q3/T4ActiveBC850C,215 (9335 897 00215)2G%BC850Cweek 34, 2003153.00.711.41E911
BC849CSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBC849C,235 (9335 896 70235)2C%BC849Cweek 34, 2003153.00.711.41E911
Reel 7" Q3/T4ActiveBC849C,215 (9335 896 70215)2C%BC849Cweek 34, 2003153.00.711.41E911
BC849BSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBC849B,215 (9335 896 60215)2B%BC849Bweek 34, 2003153.00.711.41E911
Reel 11" Q3/T4, LargePackActiveBC849B,235 (9335 896 60235)2B%BC849Bweek 34, 2003153.00.711.41E911
BC850BSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBC850B,215 (9335 896 90215)2F%BC850Bweek 34, 2003153.00.711.41E911
Reel 11" Q3/T4, LargePackActiveBC850B,235 (9335 896 90235)2F%BC850Bweek 34, 2003153.00.711.41E911
NPN general purpose transistors BC850C
Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
BC849B NXP Product Quality BC849B
BC849B NXP® Product Reliability BC849B
BC849C NXP Product Quality BC849C
BC849C NXP® Product Reliability BC849C
BC850B NXP Product Quality BC850B
BC850B NXP® Product Reliability BC850B
BC850C NXP Product Quality BC850C
BC850C NXP® Product Reliability BC850C
Letter Symbols - Transistors; General PEMD16
BC849B SPICE model BC849B
BC849C SPICE model BC849C
BC850B SPICE model BC850B
BC850C SPICE model BC850C
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
PMBFJ309