BC857BMB: 45 V,100 mA PNP通用晶体管

PNP通用晶体管,采用无引脚超小型DFN1006B-3 (SOT883B)表面贴装器件(SMD)塑料封装。

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数据手册 (1)
名称/描述Modified Date
45 V, 100 mA PNP general-purpose transistors (REV 1.0) PDF (373.0 kB) BC857XMB_SER [English]22 Feb 2012
封装信息 (1)
名称/描述Modified Date
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
BC857BMB NXP Product Quality (REV 1.2) PDF (74.0 kB) BC857BMB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC857BMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC857BMB_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementConfigurationIC [max] (mA)IC max (mA)PolarityPtot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]hFE [min]fr [min] (MHz)
BC857BMBActiveSOT883BDFN1006B-31 x 0.6 x 0.372501-100PNP-45475220100
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC857BMBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveBC857BMB,315 (9340 658 89315)0100 0101BC857BMBAlways Pb-free153.00.711.41E911
45 V, 100 mA PNP general-purpose transistors BC857BMB
BC857BMB NXP Product Quality BC857BMB
BC857BMB NXP® Product Reliability BC857BMB
BC857BMB SPICE model BC857XMB_SERIES
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
PMZB950UPE