BC859; BC860: PNP通用晶体管

PNP晶体管,采用SOT23塑料封装。

NPN补充产品:BC849和BC850。

SOT023
数据手册 (1)
名称/描述Modified Date
PNP general purpose transistors (REV 5.0) PDF (131.0 kB) BC859_BC860 [English]16 Jan 2004
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English]05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (8)
名称/描述Modified Date
BC859B NXP Product Quality (REV 1.2) PDF (74.0 kB) BC859B_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC859B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC859B_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC859C NXP Product Quality (REV 1.2) PDF (74.0 kB) BC859C_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC859C NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC859C_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC860B NXP Product Quality (REV 1.2) PDF (74.0 kB) BC860B_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC860B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC860B_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC860C NXP Product Quality (REV 1.2) PDF (74.0 kB) BC860C_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC860C NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC860C_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态
BC859CActive
BC860CActive
BC860BActive
BC859BActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC859BSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveBC859B,215 (9335 898 20215)4B%BC859Bweek 34, 2003153.00.711.41E911
BC860BSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBC860B,235 (9335 898 50235)4F%BC860Bweek 34, 2003153.00.711.41E911
Reel 7" Q3/T4ActiveBC860B,215 (9335 898 50215)4F%BC860Bweek 34, 2003153.00.711.41E911
BC859CSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBC859C,235 (9336 286 90235)4C%BC859Cweek 34, 2003153.00.711.41E911
Reel 7" Q3/T4ActiveBC859C,215 (9336 286 90215)4C%BC859Cweek 34, 2003153.00.711.41E911
BC860CSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11" Q3/T4, LargePackActiveBC860C,235 (9336 287 00235)4G%BC860Cweek 34, 2003153.00.711.41E911
Reel 7" Q3/T4ActiveBC860C,215 (9336 287 00215)4G%BC860Cweek 34, 2003153.00.711.41E911
PNP general purpose transistors BC860C
Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
BC859B NXP Product Quality BC859B
BC859B NXP® Product Reliability BC859B
BC859C NXP Product Quality BC859C
BC859C NXP® Product Reliability BC859C
BC860B NXP Product Quality BC860B
BC860B NXP® Product Reliability BC860B
BC860C NXP Product Quality BC860C
BC860C NXP® Product Reliability BC860C
Letter Symbols - Transistors; General PEMD16
BC859B SPICE model BC859B
BC859C SPICE model BC859C
BC860B SPICE model BC860B
BC860C SPICE model BC860C
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
PMBFJ309