BCP52-10: 60 V,1 A PNP中等功率晶体管

PNP中等功率晶体管,采用SOT223表面贴装器件(SMD)塑料封装。NPN补充产品:BCP55。

SOT223
数据手册 (1)
名称/描述Modified Date
60 V, 1 A PNP medium power transistors (REV 9.0) PDF (1.1 MB) BCP52_BCX52_BC52PA [English]07 Nov 2011
应用说明 (1)
名称/描述Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BCP52-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP52-10_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP52-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP52-10_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)ComplementPtot (mW)IC [max] (mA)PolarityIC max (mA)Ptot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]hFE [min]
BCP52-10ActiveSOT223SC-736.5 x 3.5 x 1.65BCP55-101000PNP13506014516063
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCP52-10SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP52-10,135 (9339 173 10135)BCP52/10BCP52-10week 34, 2003153.00.711.41E911
60 V, 1 A PNP medium power transistors BCX52-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BCP52-10 NXP Product Quality BCP52-10
BCP52-10 NXP® Product Reliability BCP52-10
Letter Symbols - Transistors; General PEMD16
BCP52-10 SPICE model BCP52-10
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
BLT81