BCP56: 80 V,1 A NPN中等功率晶体管

NPN中等功率晶体管,采用SOT223表面贴装器件(SMD)塑料封装。PNP补充产品:BCP53。

SOT223
数据手册 (1)
名称/描述Modified Date
80 V, 1 A NPN medium power transistors (REV 9.0) PDF (1.1 MB) BCP56_BCX56_BC56PA [English]07 Nov 2011
应用说明 (1)
名称/描述Modified Date
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]06 Jan 2006
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BCP56 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP56 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementIC [max] (mA)PolarityIC max (mA)Ptot [max] (mW)hFE maxVCEO [max] (V)fT [min] (MHz)hFE [max]hFE [min]
BCP56/ZLActiveSOT223SC-736.5 x 3.5 x 1.65
BCP56ActiveSOT223SC-736.5 x 3.5 x 1.65BCP531000NPN13508018025040
BCP56/ANo Longer ManufacturedSOT223SC-736.5 x 3.5 x 1.65
BCP56/RNo Longer ManufacturedSOT223SC-736.5 x 3.5 x 1.65
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCP56SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP56,115 (9339 172 40115)BCP56BCP56week 34, 2003153.00.711.41E911
Reel 11¼" Q1/T1 in LargePackActiveBCP56F (9339 172 40135)BCP56BCP56153.00.711.41E9
BCP56/ZLSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP56/ZLF (9340 707 66135)Standard MarkingBCP56/ZL153.00.711.41E9
Reel 7" Q1/T1ActiveBCP56/ZLX (9340 707 66115)Standard MarkingBCP56/ZL153.00.711.41E9
80 V, 1 A NPN medium power transistors BCX56-16
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
Medium-power general-purpose transistors BSR43
BCP56 NXP Product Quality BCP56
BCP56 NXP® Product Reliability BCP56
Letter Symbols - Transistors; General PEMD16
BCP56 SPICE model BCP56_BCX56_BC56PA
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81