BCP56-10T: 80 V,1 A NPN中等功率晶体管

NPN中等功率晶体管,采用中等功率SOT223(SC-73)表面贴装器件(SMD)塑料封装。

型号

封装

PNP补充

恩智浦

JEITA

JEDEC

BCP56T

SOT223

SC-73

-

BCP53T

BCP56-10T

BCP53-10T

BCP56-16T

BCP53-16T

SOT223
数据手册 (1)
名称/描述Modified Date
80 V, 1 A NPN medium power transistors (REV 1.0) PDF (1.2 MB) BCP56T_SER [English]05 Jul 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)ComplementIC [max] (mA)PolarityPtot [max] (mW)VCEO [max] (V)fT [min] (MHz)hFE [max]hFE [min]
BCP56-10TActiveSOT223SC-736.5 x 3.5 x 1.65BCP53-10T1000NPN13008010016063
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCP56-10TSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP56-10TX (9340 701 18115)Standard MarkingBCP56-10TAlways Pb-free153.00.711.41E911
80 V, 1 A NPN medium power transistors BCP56T_SERIES
BCP56-10T SPICE model BCP56T_SERIES
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81