BF820W: NPN高压晶体管

NPN高压晶体管,采用SOT323塑料封装。

SOT323
数据手册 (1)
名称/描述Modified Date
NPN high-voltage transistor (REV 4.0) PDF (108.0 kB) BF820W [English]09 Sep 2003
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BF820W NXP Product Quality (REV 1.2) PDF (74.0 kB) BF820W_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BF820W NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BF820W_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)hFE minVCEO [max] (V)ConfigurationfT min (MHz)IC max (mA)hFE [min]IC [max] (mA)hFE maxhFE [max]VCEO max (V)fT [min] (MHz)Ptot max (mW)Polarityfr [min] (MHz)Complement
BF820WActiveSOT323SC-702 x 1.25 x 0.9520050300160505050>50300200NPN
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BF820WSOT323Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActiveBF820W,135 (9340 334 70135)1V%BF820Wweek 30, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBF820W,115 (9340 334 70115)1V%BF820Wweek 30, 2003153.00.711.41E911
NPN high-voltage transistor BF820W
BF820W NXP Product Quality BF820W
BF820W NXP® Product Reliability BF820W
Letter Symbols - Transistors; General PEMD16
BF820W SPICE model BF820W
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BAT854CW
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
PRF947