BSP19: NPN高压晶体管

NPN晶体管,采用SOT223塑料封装。

PNP补充产品:BSP16。

SOT223
数据手册 (1)
名称/描述Modified Date
NPN high-voltage transistors (REV 3.0) PDF (95.0 kB) BSP19_20 [English]01 Jun 1999
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BSP19 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP19_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BSP19 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP19_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)hFE minPtot (mW)VCEO [max] (V)ConfigurationIC max (mA)fT min (MHz)hFE [min]IC [max] (mA)hFE maxVCEO max (V)hFE [max]Ptot max (mW)fT [min] (MHz)fr [min] (MHz)PolarityComplement
BSP19ActiveSOT223SC-736.5 x 3.5 x 1.654012003501507040100>403501200NPN
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BSP19SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBSP19,115 (9339 834 00115)BSP19BSP19week 34, 2003153.00.711.41E911
NPN high-voltage transistors BSP19
BSP19 NXP Product Quality BSP19
BSP19 NXP® Product Reliability BSP19
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BSP19 SPICE model BSP19
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81