BSP50; BSP51; BSP52: NPN达林顿晶体管
NPN达林顿晶体管，采用SOT223塑料封装。
PNP补充产品：BSP60、BSP61和BSP62。
SOT223
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN Darlington transistors (REV 3.0) PDF (120.0 kB) BSP50_51_52 [English] | 23 Apr 1999 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BSP50 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP50_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP50 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP50_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BSP51 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP51_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP51 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP51_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BSP52 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP52_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP52 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP52_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BSP50 SPICE model (REV 1.4) prm BSP50 7/22/2012
- BSP51 SPICE model (REV 1.4) prm BSP51 7/22/2012
- BSP52 SPICE model (REV 1.4) prm BSP52 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BSP51 | Active |
| BSP52 | Active |
| BSP50 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP50 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP50,115 (9339 863 30115) | BSP50 | BSP50 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BSP52 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP52,115 (9339 694 70115) | BSP52 | BSP52 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BSP51 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP51,115 (9339 863 40115) | BSP51 | BSP51 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BSP50 NXP Product Quality BSP50
- BSP50 NXP® Product Reliability BSP50
- BSP51 NXP Product Quality BSP51
- BSP51 NXP® Product Reliability BSP51
- BSP52 NXP Product Quality BSP52
- BSP52 NXP® Product Reliability BSP52
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BSP50 SPICE model BSP50_BSP51_BSP52
- BSP51 SPICE model BSP51
- BSP52 SPICE model BSP52
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
