CBTD3306: 双路总线开关，具有电平转换
CBTD3306双路FET总线开关具有独立的线路开关。相关输出使能(nOE)输入为高电平时，每个开关都处于禁用状态。
CBTD3306的特点是工作温度范围为-40 °C至+85 °C。
CBTD3306: 产品结构框图
sot530-1_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Dual bus switch with level shifting (REV 8.0) PDF (215.0 kB) CBTD3306 [English] | 01 May 2012 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
手册 (2)
| 名称/描述 | Modified Date |
|---|---|
| 電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English] | 16 Feb 2015 |
| Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English] | 20 May 2014 |
选型工具指南 (2)
| 名称/描述 | Modified Date |
|---|---|
| ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English] | 19 Nov 2015 |
| Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English] | 08 Jan 2015 |
封装信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| Plastic extremely thin quad flat package; no leads; 8 terminals (REV 1.3) PDF (206.0 kB) SOT902-2 [English] | 14 Jul 2016 |
| plastic thin shrink small outline package; 8 leads; body width 4.4 mm (REV 1.0) PDF (182.0 kB) SOT530-1 [English] | 08 Feb 2016 |
| plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm (REV 1.0) PDF (201.0 kB) SOT833-1 [English] | 08 Feb 2016 |
| plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-1 [English] | 08 Feb 2016 |
包装 (3)
| 名称/描述 | Modified Date |
|---|---|
| XQFN8(U); Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or... (REV 1.0) PDF (201.0 kB) SOT902-2_125 [English] | 02 May 2013 |
| SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (232.0 kB) SOT96-1_118 [English] | 19 Apr 2013 |
| Standard product orientation 12NC ending 115 (REV 3.0) PDF (88.0 kB) SOT833-1_115 [English] | 05 Apr 2013 |
支持信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT833 Topmark (REV 1.0) PDF (75.0 kB) MAR_SOT833 [English] | 03 Jun 2013 |
| Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English] | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English] | 08 Oct 2009 |
IBIS
- cbtd3306 IBIS model (REV 1.0) ibs CBTD3306_1 4/7/2013
订购信息
| 型号 | 状态 | Family | 说明 | VCC (V) | VPASS (V) | Logic switching levels | f(-3dB) (MHz) | No of bits | tpd (ns) | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | No of pins | Package name | Package version |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CBTD3306GT | Active | CBT(D) | dual bus switch level translator | 4.5 - 5.5 | 3.3 | TTL | 300 | 2 | 0.25 | very Low | -40~85 | 353 | 7.6 | 175 | 8 | XSON8 | SOT833-1 |
| CBTD3306D | Active | CBT(D) | dual bus switch level translator | 4.5 - 5.5 | 3.3 | TTL | 300 | 2 | 0.25 | very Low | -40~85 | 158 | 43.0 | 8 | SO8 | SOT96-1 | |
| CBTD3306PW | Active | CBT(D) | dual bus switch level translator | 4.5 - 5.5 | 3.3 | TTL | 300 | 2 | 0.25 | very Low | -40~85 | 120 | 30.0 | 8 | TSSOP8 | SOT530-1 | |
| CBTD3306GM | Active | CBT(D) | dual bus switch level translator | 4.5 - 5.5 | 3.3 | TTL | 300 | 2 | 0.25 | very Low | -40~85 | 297 | 131.0 | 8 | XQFN8 | SOT902-2 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CBTD3306GM |  | SOT902-2 | Reel 7" Q3/T4, Reverse | Active | CBTD3306GM,125 (9352 914 19125) | W06 | CBTD3306GM |    | Always Pb-free | 1 | 1 | |
| CBTD3306PW | | SOT530-1 | Reel 13" Q1/T1 | Active | CBTD3306PW,118 (9352 705 12118) | D306 | CBTD3306PW | | week 9, 2005 | 1 | 1 | |
| CBTD3306GT |  | SOT833-1 | Reel 7" Q1/T1 | Active | CBTD3306GT,115 (9352 914 21115) | W06 | CBTD3306GT | | Always Pb-free | 1 | 1 | |
| CBTD3306D |  | SOT96-1 | SO-SOJ-REFLOW
SO-SOJ-WAVE SO-SOJ-REFLOW SO-SOJ-WAVE | Reel 13" Q1/T1 | Active | CBTD3306D,118 (9352 705 13118) | CBD3306 | CBTD3306D |  | week 5, 2005 | 1 | 1 |
| Bulk Pack | Active | CBTD3306D,112 (9352 705 13112) | CBD3306 | CBTD3306D | | week 5, 2005 | 1 | 1 |
- Dual bus switch with level shifting CBTD3306PW
- MicroPak soldering information NTS0102_Q100
- 電圧レベルシフタ 74AVC16245DGG-Q100
- Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
- ロジック製品セレクションガイド... 74LVC_H_245A_Q100
- Logic selection guide 2016 74LVC_H_245A_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- MAR_SOT833 Topmark NCX2222
- cbtd3306 IBIS model CBTD3306PW
- Plastic extremely thin quad flat package; no leads; 8 terminals pca9509agm
- XQFN8(U); Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or... pca9509agm
- plastic thin shrink small outline package; 8 leads; body width 4.4 mm CBT3306_Q100
- plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm NCX2222
- Standard product orientation 12NC ending 115 NCX2222
- plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
- Footprint for reflow soldering NPIC6C596A_Q100
- Footprint for wave soldering NPIC6C596A_Q100
- SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... CBT3306_Q100
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