LM75B: 数字温度传感器与温度监控器

LM75B是一款温度-数字转换器,采用片内带隙温度传感器和Σ-Δ型A-D转换技术制造,提供过温检测输出。LM75B集成一系列数据寄存器:配置寄存器(Conf),用于存储器件设置,如器件工作模式、OS工作模式、OS极性和OS故障队列;温度寄存器(Temp),用于存储数字温度读数;以及设定点寄存器(Tos和Thyst),用于存储可编程过温关断和迟滞限值,可通过双线式串行I²总线接口与控制器通信。该器件还提供开漏输出(OS),可在温度超过编程限值时激活。具有三个可选逻辑地址针脚,因此一条总线上可以连接8个器件,不会产生地址冲突。

LM75B可针对不同工作条件进行配置。可将其设为正常工作模式以便周期性监控环境温度,或者设为关断模式以便最大程度降低功耗。OS输出可在两种可选模式中的任意一种下工作:OS比较器模式或OS中断模式。它的激活状态可选为高电平或低电平。可对定义连续故障数量以激活OS输出的故障队列进行编程,也可对设定点限值进行编程。

温度寄存器始终存储11位二进制补码数据,温度分辨率为0.125 °C。对于精确测量热漂移或热逃逸的应用,这一较高的温度分辨率尤其有用。访问LM75B时,正在进行中的转换不会被中断(如I²C总线部分完全独立于Σ-Δ型转换器部分),并且如果连续访问LM75B且未在两次通信之间至少等待一次转换时间,则不会阻止器件将温度寄存器更新到新的转换结果。温度寄存器更新后,新的转换结果将立即可用。

上电后,LM75B进入正常工作模式,OS进入比较器模式,温度阈值为80 ℃,迟滞为75 ℃,因此可用作具有预定义温度设定点的独立恒温器。

LM75B: 产品结构框图
Outline 3d SOT505-1
数据手册 (1)
名称/描述Modified Date
Digital temperature sensor and thermal watchdog (REV 6.1) PDF (527.0 kB) LM75B [English]06 Feb 2015
应用说明 (3)
名称/描述Modified Date
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
Level shifting techniques in I2C-bus design (REV 1.0) PDF (52.0 kB) AN10441 [English]20 Jun 2007
I2C manual (REV 1.0) PDF (4.2 MB) AN10216 [English]27 Mar 2003
用户指南 (3)
名称/描述Modified Date
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 [English]28 Apr 2014
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA [English]03 Apr 2013
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 [English]13 Jun 2006
手册 (2)
名称/描述Modified Date
NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 [English]01 Aug 2014
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English]01 Jun 2008
封装信息 (4)
名称/描述Modified Date
HWSON8: plastic thermal enhanced very very thin small outline package, no leads; 8 terminals; (REV 1.1) PDF (190.0 kB) SOT1069-2 [English]10 Jun 2016
plastic thin shrink small outline package; 8 leads; body width 3 mm (REV 1.0) PDF (240.0 kB) SOT505-1 [English]08 Feb 2016
plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-1 [English]08 Feb 2016
plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm (REV 1.0) PDF (190.0 kB) SOT996-2 [English]08 Feb 2016
包装 (4)
名称/描述Modified Date
HWSON8; Reel pack, SMD, 7" Q2/T3 Turned 90 degree product orientation Orderable part number ending, 147 or... (REV 1.0) PDF (196.0 kB) SOT1069-2_147 [English]06 May 2014
XSON8(U); Reel pack, Reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or... (REV 5.0) PDF (200.0 kB) SOT996-2_125 [English]02 May 2013
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (232.0 kB) SOT96-1_118 [English]19 Apr 2013
TSSOP8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (214.0 kB) SOT505-1_118 [English]15 Apr 2013
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
IBIS
订购信息
型号状态Package version
LM75BTPActiveSOT1069-2
LM75BDActiveSOT96-1
LM75BGDActiveSOT996-2
LM75BDPActiveSOT505-1
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
LM75BDPSOT505-1Reflow_Soldering_ProfileReel 13" Q1/T1ActiveLM75BDP,118 (9352 858 36118)LM75BLM75BDPAlways Pb-free0.02.05E811
LM75BDP/DGSOT505-1Reflow_Soldering_ProfileReel 13" Q1/T1ActiveLM75BDP/DG,118 (9352 933 85118)LM75BLM75BDP/DGAlways Pb-free0.02.05E811
LM75BDSOT96-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1ActiveLM75BD,118 (9352 858 37118)LM75BDLM75BDAlways Pb-free0.02.05E811
Bulk PackActiveLM75BD,112 (9352 858 37112)LM75BDLM75BDAlways Pb-free0.02.05E811
LM75BGDSOT996-2Reel 7" Q3/T4, ReverseActiveLM75BGD,125 (9352 882 39125)75BLM75BGDAlways Pb-free0.02.05E811
LM75BTPSOT1069-2Reel 7" Q2/T3ActiveLM75BTP,147 (9352 965 01147)M75LM75BTPAlways Pb-free0.02.05E811
Digital temperature sensor and thermal watchdog lm75b
MicroPak soldering information NTS0102_Q100
Level shifting techniques in I2C-bus design pca9685pw
I2C manual se98apw
I2C-bus specification and user manual pca9685pw
I2C-bus specification and user manual pca9685pw
I2C Demonstration Board 2005-1 Quick Start Guide pca9685pw
NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns pca9685pw
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LM75B IBIS model LM75BDP
LM75BDP IBIS model LM75BDP
plastic thin shrink small outline package; 8 leads; body width 3 mm pesd5v0l7bas
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... pesd5v0l7bas
plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... CBT3306_Q100
plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm 74AHC_T_3G14_Q100
XSON8(U); Reel pack, Reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or... 74AHC_T_3G14_Q100
HWSON8: plastic thermal enhanced very very thin small outline package, no leads; 8 terminals; PCT2075TP
HWSON8; Reel pack, SMD, 7" Q2/T3 Turned 90 degree product orientation Orderable part number ending, 147 or... PCT2075TP
LM75B
PCT2075
SA612A
LM75B
PCT2075