MMG3005NT1: 800-2200 MHz,15 dB,30 dBm InGaP HBT GPA

特性
  • 频率:800–2200 MHz
  • P1dB:30 dBm @ 2140 MHz
  • 小信号增益:15 dB @ 2140 MHz
  • 输出三阶交调点:47 dBm @ 2140 MHz
  • 5 V单电源
  • 内部预匹配至50 Ohms
  • 符合RoHS规范
  • 采用盘卷包装。T1后缀 = 1000个,16 mm卷带宽度,13英寸卷盘。
PQFN 5x5 Package Image
数据手册 (1)
名称/描述Modified Date
MMG3005NT1 800-2200 MHz, 15 dB, 30 dBm InGaP HBT GPA Data Sheet (REV 9) PDF (401.3 kB) MMG3005NT1 [English]31 Oct 2014
应用说明 (3)
名称/描述Modified Date
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN1955 [English]29 Apr 2014
General Purpose Amplifier and MMIC Biasing (REV 3) PDF (164.3 kB) AN3100 [English]30 Mar 2011
PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 (REV 0) PDF (632.0 kB) AN3778 [English]26 Feb 2010
简介 (1)
名称/描述Modified Date
General Purpose Amplifiers Fact Sheet (REV 2) PDF (157.1 kB) RFGPAFS [English]30 Dec 2014
手册 (1)
名称/描述Modified Date
RF GaAs Solutions (REV 1) PDF (416.3 kB) BR1609 [English]21 Dec 2011
选型工具指南 (1)
名称/描述Modified Date
RF Products Selector Guide (REV 43) PDF (3.8 MB) SG46 [English]26 May 2016
快速参考指南 (1)
名称/描述Modified Date
RF MMIC and GPA Cross Reference (REV 2) PDF (1.1 MB) MMICGPAQRG [English]21 Dec 2011
封装信息 (1)
名称/描述Modified Date
98ARL10575D, PQFN-EP, 5.0x5.0x2.1, Pitch 0.8, 16 Pins (REV G) PDF (62.4 kB) 98ARL10575D [English]18 Jan 2016
印刷电路板
订购信息
型号状态状态Frequency Min (Min) (MHz)Frequency Max (Max) (MHz)模具技术供电电压 (Min-Max) (V)电源电流 (Typ) (mA)功率增益 (Typ) (dB) @ f (MHz)P1dB (Typ) (dBm)输出功率 (Typ) (dBm) @ f (MHz)三阶交调截取点 (Typ) (dBm)噪声系数 (Typ) (dB) @ f (MHz)热阻 (Spec)(°C/W)类型
MMG3005NT1Active8002200InGaP HBT5 to 548015 @ 21403030 @ 2140475 @ 214021.5A
封装环保信息
封装说明Outline Version包装产品状态部件编号化学成分RoHS / Pb Free中国RoHS查询MSLPPT (°C)
PWR QFN 16 5*5*2.1P0.898ARL10575DMPQ - 1000 REELPOQ - 1000 REELActiveMMG3005NT1MMG3005NT1.pdf3260
MMG3005NT1 800-2200 MHz, 15 dB, 30 dBm InGaP HBT GPA Data Sheet MMG3005NT1
MMG3005NT1 800-2200 MHz, 15 dB, 30 dBm InGaP HBT GPA Data Sheet MMG3005NT1
MMG3005NT1.pdf MMG3005NT1
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
General Purpose Amplifier and MMIC Biasing MMA25312B
PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 MMG3006NT1
General Purpose Amplifiers Fact Sheet MMG3H21NT1
RF GaAs Solutions MMZ25332B
RF Products Selector Guide MMT20303H
RF MMIC and GPA Cross Reference MMZ25332B
MMG3004NT1, MMG3005NT1 CAD DXF File MMG3005NT1
98ARL10575D, PQFN-EP, 5.0x5.0x2.1, Pitch 0.8, 16 Pins MMG3005NT1
MMG3005NT1.pdf MMG3005NT1