NXP3875G: 50 V,150 mA NPN通用晶体管

NPN通用晶体管,采用小型SOT23 (TO-236AB)表面贴装器件(SMD)塑料封装。

SOT023
数据手册 (1)
名称/描述Modified Date
50 V, 150 mA NPN general-purpose transistors (REV 1.1) PDF (1.0 MB) NXP3875Y_NXP3875G [English]12 Dec 2012
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
NXP3875G NXP Product Quality (REV 1.2) PDF (74.0 kB) NXP3875G_NXP_PRODUCT_QUALITY [English]31 Jan 2015
NXP®3875G NXP Product Reliability (REV 1.1) PDF (82.0 kB) NXP3875G_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ConfigurationVCEO [max] (V)IC max (mA)hFE [min]hFE maxIC [max] (mA)hFE [max]fT [min] (MHz)fr [min] (MHz)PolarityComplement
NXP3875GActiveSOT23TO-236AB2.9 x 1.3 x 120015020015040080NPN
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
NXP3875GSOT23Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4ActiveNXP3875GR (9340 672 39215)%JFNXP3875GAlways Pb-free153.00.711.41E911
50 V, 150 mA NPN general-purpose transistors NXP3875Y
NXP3875G NXP Product Quality NXP3875G
NXP®3875G NXP Product Reliability NXP3875G
NXP3875G SPICE model NXP3875Y_NXP3875G
plastic surface-mounted package; 3 leads BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
PMBFJ309