PBHV8560Z: 600 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor

NPN high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) medium power Surface-Mounted Device (SMD) plastic package.

PNP complement: PBHV9560Z

SOT223
数据手册 (1)
名称/描述Modified Date
600 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor (REV 1.0) PDF (213.0 kB) PBHV8560Z [English]13 Mar 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)PolarityPtot [max] (mW)VCEO [max] (V)IC [max] (A)VCEsat [max] (mV)RCEsat@IC [max]; IC/IB =10 [typ] (mΩ)hFE [min]fT [typ] (MHz)
PBHV8560ZActiveSOT223SC-736.5 x 3.5 x 1.65NPN6506000.510070
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBHV8560ZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBHV8560ZX (9340 685 92115)HV856ZPBHV8560ZAlways Pb-free153.00.711.41E911
600 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8560Z
PBHV8560Z SPICE Model PBHV8560Z
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81