PBSS306PZ: 100 V,4.1 A PNP低VCEsat (BISS)晶体管

PNP低VCEsat突破性小信号(BISS)晶体管,采用SOT223 (SC-73)小型表面贴装器件(SMD)塑料封装。NPN补充产品:PBSS306NZ。

PBSS306PZ: 产品结构框图
PBSS306PZ: 应用结构框图
SOT223
数据手册 (1)
名称/描述Modified Date
100 V, 4.1 A PNP low VCEsat (BISS) transistor (REV 3.0) PDF (197.0 kB) PBSS306PZ [English]29 Jul 2011
应用说明 (1)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSS306PZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS306PZ_1 [English]31 Jan 2015
PBSS306PZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS306PZ_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Transistor polaritytransistor polarityPtot [max] (mW)number of transistorsVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS306PZActiveSOT223SC-736.5 x 3.5 x 1.65PNP7001-100-4.1-8.220030010056-6580
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSS306PZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActivePBSS306PZ,135 (9340 590 54135)S306PZPBSS306PZAlways Pb-free153.00.711.41E911
100 V, 4.1 A PNP low VCEsat (BISS) transistor PBSS306PZ
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS306PZ NXP® Product Reliability PBSS306PZ
PBSS306PZ NXP Product Quality PBSS306PZ
PBSS306PZ SPICE model PBSS306PZ
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
PBHV9115Z
PBHV9115Z
BLT81