PBSS4160DS: 60 V、1 A NPN/PNP低VCEsat (BISS)晶体管
NPN/NPN低VCEsat突破性小信号(BISS)晶体管对，采用SOT457 (SC-74)表面贴装器件(SMD)塑料封装。
PNP/PNP补充：PBSS5160DS。
PBSS4160DS: 产品结构框图
PBSS4160DS: 应用结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 60 V, 1 A NPN/NPN low VCEsat (BISS) transistor (REV 4.0) PDF (208.0 kB) PBSS4160DS [English] | 25 Jan 2010 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (3)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
| TSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (187.0 kB) SOT457_165 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS4160DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4160DS_1 [English] | 31 Jan 2015 |
| PBSS4160DS NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4160DS_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- PBSS4160DS SPICE model (REV 1.4) prm PBSS4160DS_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | transistor polarity | Transistor polarity | Polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | VCEsat [max] (NPN) (mV) | hFE [typ] | fT [typ] (MHz) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4160DS | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | NPN | NPN | 420 | 2 | 60 | 0.87 | 2 | 250 | 250 | 500 | 220 | 250 | 150 | 200 | 250 | 250 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4160DS | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q3/T4 in LargePack, Reverse | Active | PBSS4160DSZ (9340 581 15165) | B8 | PBSS4160DS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4, Reverse | Active | PBSS4160DSH (9340 581 15125) | B8 | PBSS4160DS | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| Reel 7" Q1/T1 | Active | PBSS4160DS,115 (9340 581 15115) | B8 | PBSS4160DS | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS4160DS NXP® Product Reliability PBSS4160DS
- PBSS4160DS NXP Product Quality PBSS4160DS
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PBSS4160DS SPICE model PBSS4160DS
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; reel pack; reversed product orientation; 12NC ending 165 bza456a
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- PESDXS5UD_SERIES
- PBSS4160DS
- SSL5021_SSL5031
