PBSS5350D: 50 V，3 A PNP低VCEsat (BISS)晶体管 _ BDTIC 中国领先电子元器件代理商

PBSS5350D: 50 V，3 A PNP低VCEsat (BISS)晶体管

PNP低VCEsat突破性小信号(BISS)晶体管，采用小型SOT457 (SC-74)表面贴装器件(SMD)塑料封装。NPN补充产品：PBSS4350D

SOT457

数据手册 (1)

名称/描述	Modified Date
50 V, 3 A PNP low VCEsat (BISS) transistor (REV 6.0) PDF (253.0 kB) PBSS5350D [English]	30 Jun 2011

应用说明 (2)

名称/描述	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]	12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]	06 Jan 2006

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]	08 Feb 2016

包装 (3)

名称/描述	Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English]	30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English]	30 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 [English]	30 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
PBSS5350D NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5350D_1 [English]	31 Jan 2015
PBSS5350D NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5350D_NXP_PRODUCT_QUALITY [English]	31 Jan 2015

支持信息 (3)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]	03 Jun 2013

SPICE

PBSS5350D SPICE model (REV 1.4) prm PBSS5350D_1_2_3 7/22/2012

软件

PBSS5350D_1_2_3_4 (REV 0.1) olb PBSS5350D_1_2_3_4 11/21/2008

订购信息

型号	状态	Package version	Package name	大小 (mm)	Transistor polarity	transistor polarity	P_tot [max] (mW)	number of transistors	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	h_FE [typ]	f_T [typ] (MHz)	f_T [min] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS5350D	Active	SOT457	TSOP6	2.9 x 1.5 x 1		PNP	600	1	-50	-3	-5	200			100	120	-100	150
PBSS5350D/DG	No Longer Manufactured	SOT457	TSOP6	2.9 x 1.5 x 1		PNP	600		-50	-3	-5	200				120	-100

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
PBSS5350D		SOT457	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	PBSS5350D,115 (9340 559 46115)	53	PBSS5350D		week 22, 2003	153.0	0.71	1.41E9	1	1
				Reel 11¼" Q1/T1 in LargePack	Active	PBSS5350D,135 (9340 559 46135)	53	PBSS5350D		week 22, 2003	153.0	0.71	1.41E9	1	1
				Reel 7" Q3/T4, Reverse	Active	PBSS5350D,125 (9340 559 46125)	53	PBSS5350D		Always Pb-free	153.0	0.71	1.41E9	1	1

50 V, 3 A PNP low VCEsat (BISS) transistor PBSS5350D

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

PBSS5350D NXP® Product Reliability PBSS5350D

PBSS5350D NXP Product Quality PBSS5350D

MAR_SOT457 Topmark 74LVC2G17_Q100

PBSS5350D SPICE model PBSS5350D

PBSS5350D_1_2_3_4 PBSS5350D

plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud

Tape reel SMD; standard product orientation 12NC ending 135 bza456a

Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100

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